Integration of Electrodeposited Ni-Fe in MEMS with Low-Temperature Deposition and Etch Processes

Giuseppe Schiavone*, Jeremy Murray, Richard Perry, Andrew R. Mount, Marc Phillipe Yves Desmulliez, Anthony J. Walton

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

6 Citations (Scopus)
23 Downloads (Pure)


This article presents a set of low-temperature deposition and etching processes for the integration of electrochemically deposited Ni-Fe alloys in complex magnetic microelectromechanical systems, as Ni-Fe is known to suffer from detrimental stress development when subjected to excessive thermal loads. A selective etch process is reported which enables the copper seed layer used for electrodeposition to be removed while preserving the integrity of Ni-Fe. In addition, a low temperature deposition and surface micromachining process is presented in which silicon dioxide and silicon nitride are used, respectively, as sacrificial material and structural dielectric. The sacrificial layer can be patterned and removed by wet buffered oxide etch or vapour HF etching. The reported methods limit the thermal budget and minimise the stress development in Ni-Fe. This combination of techniques represents an advance towards the reliable integration of Ni-Fe components in complex surface micromachined magnetic MEMS.

Original languageEnglish
Article number323
Issue number3
Publication statusPublished - 22 Mar 2017


  • Magnetic microactuators
  • MEMS
  • Ni-Fe electroplating
  • Ni-Fe integration
  • Permalloy
  • Selective etching
  • Surface micromachining

ASJC Scopus subject areas

  • Materials Science(all)


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