Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Jack Hoyd Gigg Ng; Robert T. Ssekitoleko; David Flynn; Robert W. Kay; Christine Démoré; Sandy Cochran; Marc P Y Desmulliez

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Jack Hoyd Gigg Ng^*, Robert T. Ssekitoleko, David Flynn, Robert W. Kay, Christine Démoré, Sandy Cochran, Marc P Y Desmulliez

^*Corresponding author for this work

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Original language	English
Title of host publication	EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
Place of Publication	Piscataway (New Jersey)
Publisher	IEEE
ISBN (Electronic)	0956808603
Publication status	Published - 2011
Event	18th European Microelectronics and Packaging Conference, EMPC-2011 - Brighton, United Kingdom Duration: 12 Sept 2011 → 15 Sept 2011

Conference

Conference	18th European Microelectronics and Packaging Conference, EMPC-2011
Country/Territory	United Kingdom
City	Brighton
Period	12/09/11 → 15/09/11

Keywords

3D packaging
high frequency ultrasound
Linear array transducer

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

@inproceedings{d12e3657b5924055883e0a912021683b,

title = "Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications",

abstract = "This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.",

keywords = "3D packaging, high frequency ultrasound, Linear array transducer",

author = "Ng, {Jack Hoyd Gigg} and Ssekitoleko, {Robert T.} and David Flynn and Kay, {Robert W.} and Christine D{\'e}mor{\'e} and Sandy Cochran and Desmulliez, {Marc P Y}",

year = "2011",

language = "English",

booktitle = "EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings",

publisher = "IEEE",

address = "United States",

note = "18th European Microelectronics and Packaging Conference, EMPC-2011 ; Conference date: 12-09-2011 Through 15-09-2011",

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Ng, JHG, Ssekitoleko, RT, Flynn, D, Kay, RW, Démoré, C, Cochran, S & Desmulliez, MPY 2011, Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. in EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings., 6142354, IEEE, Piscataway (New Jersey), 18th European Microelectronics and Packaging Conference, EMPC-2011, Brighton, United Kingdom, 12/09/11.

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. / Ng, Jack Hoyd Gigg; Ssekitoleko, Robert T.; Flynn, David et al.
EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. Piscataway (New Jersey): IEEE, 2011. 6142354.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

AU - Ng, Jack Hoyd Gigg

AU - Ssekitoleko, Robert T.

AU - Flynn, David

AU - Kay, Robert W.

AU - Démoré, Christine

AU - Cochran, Sandy

AU - Desmulliez, Marc P Y

PY - 2011

Y1 - 2011

N2 - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

AB - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

KW - 3D packaging

KW - high frequency ultrasound

KW - Linear array transducer

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M3 - Conference contribution

AN - SCOPUS:84857552861

BT - EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

PB - IEEE

CY - Piscataway (New Jersey)

T2 - 18th European Microelectronics and Packaging Conference, EMPC-2011

Y2 - 12 September 2011 through 15 September 2011

ER -

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Abstract

Conference

Keywords

ASJC Scopus subject areas

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