Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Jack Hoyd Gigg Ng, Robert T. Ssekitoleko, David Flynn, Robert W. Kay, Christine Démoré, Sandy Cochran, Marc P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Original languageEnglish
Title of host publicationEMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
Place of PublicationPiscataway (New Jersey)
PublisherIEEE
ISBN (Electronic)0956808603
Publication statusPublished - 2011
Event18th European Microelectronics and Packaging Conference, EMPC-2011 - Brighton, United Kingdom
Duration: 12 Sep 201115 Sep 2011

Conference

Conference18th European Microelectronics and Packaging Conference, EMPC-2011
CountryUnited Kingdom
CityBrighton
Period12/09/1115/09/11

Keywords

  • 3D packaging
  • high frequency ultrasound
  • Linear array transducer

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Ng, J. H. G., Ssekitoleko, R. T., Flynn, D., Kay, R. W., Démoré, C., Cochran, S., & Desmulliez, M. P. Y. (2011). Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings [6142354] IEEE.