Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

Jack Hoyd Gigg Ng, Robert T. Ssekitoleko, David Flynn, Robert W. Kay, Christine Démoré, Sandy Cochran, Marc P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

Original languageEnglish
Title of host publicationEMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings
Place of PublicationPiscataway (New Jersey)
PublisherIEEE
ISBN (Electronic)0956808603
Publication statusPublished - 2011
Event18th European Microelectronics and Packaging Conference, EMPC-2011 - Brighton, United Kingdom
Duration: 12 Sep 201115 Sep 2011

Conference

Conference18th European Microelectronics and Packaging Conference, EMPC-2011
CountryUnited Kingdom
CityBrighton
Period12/09/1115/09/11

Fingerprint

Ultrasonic transducers
Medical applications
Photolithography
Needles
Transducers
Packaging
Ultrasonics
Networks (circuits)
Temperature

Keywords

  • 3D packaging
  • high frequency ultrasound
  • Linear array transducer

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Ng, J. H. G., Ssekitoleko, R. T., Flynn, D., Kay, R. W., Démoré, C., Cochran, S., & Desmulliez, M. P. Y. (2011). Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings [6142354] Piscataway (New Jersey): IEEE.
Ng, Jack Hoyd Gigg ; Ssekitoleko, Robert T. ; Flynn, David ; Kay, Robert W. ; Démoré, Christine ; Cochran, Sandy ; Desmulliez, Marc P Y. / Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. Piscataway (New Jersey) : IEEE, 2011.
@inproceedings{d12e3657b5924055883e0a912021683b,
title = "Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications",
abstract = "This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.",
keywords = "3D packaging, high frequency ultrasound, Linear array transducer",
author = "Ng, {Jack Hoyd Gigg} and Ssekitoleko, {Robert T.} and David Flynn and Kay, {Robert W.} and Christine D{\'e}mor{\'e} and Sandy Cochran and Desmulliez, {Marc P Y}",
year = "2011",
language = "English",
booktitle = "EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings",
publisher = "IEEE",
address = "United States",

}

Ng, JHG, Ssekitoleko, RT, Flynn, D, Kay, RW, Démoré, C, Cochran, S & Desmulliez, MPY 2011, Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. in EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings., 6142354, IEEE, Piscataway (New Jersey), 18th European Microelectronics and Packaging Conference, EMPC-2011, Brighton, United Kingdom, 12/09/11.

Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. / Ng, Jack Hoyd Gigg; Ssekitoleko, Robert T.; Flynn, David; Kay, Robert W.; Démoré, Christine; Cochran, Sandy; Desmulliez, Marc P Y.

EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. Piscataway (New Jersey) : IEEE, 2011. 6142354.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

TY - GEN

T1 - Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications

AU - Ng, Jack Hoyd Gigg

AU - Ssekitoleko, Robert T.

AU - Flynn, David

AU - Kay, Robert W.

AU - Démoré, Christine

AU - Cochran, Sandy

AU - Desmulliez, Marc P Y

PY - 2011

Y1 - 2011

N2 - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

AB - This article presents the innovative manufacturing and 3-dimensional packaging of a miniaturized ultrasonic transducer for medical applications. A spirally rolled-up flexible circuit was employed for the interconnection of a linear transducer array to be used in a needle size footprint. Photolithography, precision dicing and low temperature conductive bonding are amongst the technologies under investigation for the realization of this high frequency ultrasound device.

KW - 3D packaging

KW - high frequency ultrasound

KW - Linear array transducer

UR - http://www.scopus.com/inward/record.url?scp=84857552861&partnerID=8YFLogxK

M3 - Conference contribution

BT - EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings

PB - IEEE

CY - Piscataway (New Jersey)

ER -

Ng JHG, Ssekitoleko RT, Flynn D, Kay RW, Démoré C, Cochran S et al. Innovative manufacturing and 3-dimensional packaging methods of micro ultrasonic transducers for medical applications. In EMPC-2011 - 18th European Microelectronics and Packaging Conference, Proceedings. Piscataway (New Jersey): IEEE. 2011. 6142354