Abstract
Purpose
The purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials.
Design/methodology/approach
This paper gives a detailed literature survey of research carried out in inkjet printing of conductive materials.
Findings
This article explains the inkjet printing process and the various types of conductive inks. It then examines the various factors that affect the quality of inkjet printed interconnects such as printing parameters, materials and substrate treatments. Methods of characterising both the inkjet printing process and the electrical properties of printed conductive materials are also presented. Finally relevant applications of this technology are described.
Originality/value
Inkjet printing is currently one of the cheapest direct write techniques for manufacturing. The use of this technique in electronic manufacturing, where interconnects and other conductive features are required is an area of increasing relevance to the fields of electronics manufacturing, packaging and assembly. This review paper would therefore be of great value and interest to this community.
The purpose of this paper is to present an exhaustive review of research studies and activities in the inkjet printing of conductive materials.
Design/methodology/approach
This paper gives a detailed literature survey of research carried out in inkjet printing of conductive materials.
Findings
This article explains the inkjet printing process and the various types of conductive inks. It then examines the various factors that affect the quality of inkjet printed interconnects such as printing parameters, materials and substrate treatments. Methods of characterising both the inkjet printing process and the electrical properties of printed conductive materials are also presented. Finally relevant applications of this technology are described.
Originality/value
Inkjet printing is currently one of the cheapest direct write techniques for manufacturing. The use of this technique in electronic manufacturing, where interconnects and other conductive features are required is an area of increasing relevance to the fields of electronics manufacturing, packaging and assembly. This review paper would therefore be of great value and interest to this community.
| Original language | English |
|---|---|
| Pages (from-to) | 193-213 |
| Number of pages | 21 |
| Journal | Circuit World |
| Volume | 38 |
| Issue number | 4 |
| DOIs | |
| Publication status | Published - 2012 |