The use of millimeter wave bands presents an exciting possibility for Radio Frequency Identification (RFID) and wireless power transfer technologies since it allows for low power, low profile yet high performance circuits and provides a larger bandwidth for communication. Furthermore, inkjet printing fabrication permits the fast prototyping of millimeter wave circuits using a variety of low cost and flexible substrate materials. In this work we present the design of a millimeter wave rectenna inkjet-printed on glossy photo-paper substrate and integrating an off-the-shelf Schottky diode. The design has been optimized using harmonic balance optimization combined with electromagnetic simulation in order to maximize the RF-dc conversion efficiency. The simulated rectenna RF-dc efficiency was 35.2% for 15 dBm input power across an optimal load of 280 Ohm.
|Title of host publication||2017 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP)|
|Publication status||Published - 8 Jan 2018|
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Computer Networks and Communications