Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias

Jens Kaufmann, M. P Y Desmulliez, Dennis Price, Mike Hughes, Nadia Strussevich, Chris Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

This paper presents preliminary studies in electroplating using megasonic agitation to avoid the formation of voids within high aspect ratio microvias that are used for the redistribution of interconnects in high density interconnection technology in printed circuit boards. Through this technique, uniform deposition of metal on the side walls of the vias is possible. High frequency acoustic streaming at megasonic frequencies enables the decrease of the Nernst diffusion layer down to the sub-micron range, allowing thereby conformal electrodeposition in deep grooves. This effect enables the normally convection free liquid near the surface to be agitated. Higher throughput and better control of the material properties of the deposits can be achieved for the manufacturing of embedded interconnections and metal-based MEMS. For optimal filling performance of the microvias, a full Design of Experiments (DOE) and a multi-physics numerical simulation have been conducted to analyse the influence of megasonic agitation on the plating quality of the microvias. Megasonic based deposition has been found to increase the deposition rate as well as improving the quality of the metal deposits. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages1235-1239
Number of pages5
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

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  • Cite this

    Kaufmann, J., Desmulliez, M. P. Y., Price, D., Hughes, M., Strussevich, N., & Bailey, C. (2008). Influence of megasonic agitation on the electrodeposition of high aspect ratio blind vias. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 1235-1239) https://doi.org/10.1109/ESTC.2008.4684530