Original language | English |
---|---|
Pages (from-to) | 161-168 |
Number of pages | 8 |
Journal | Microelectronics Journal |
Volume | 30 |
Issue number | 2 |
DOIs | |
Publication status | Published - Feb 1999 |
Improving the wire bonding process quality using statistically designed experiments
Jiju Antony
Research output: Contribution to journal › Article › peer-review
37
Citations
(Scopus)