Impact of assembly process technologies on electronic packaging materials

T. Tilford; C. Bailey; A. K. Parrott; K. L. Sinclair; M. P Y Desmulliez

doi:10.1109/PORTABLE-POLYTRONIC.2008.4681300

Impact of assembly process technologies on electronic packaging materials

T. Tilford
, C. Bailey
, A. K. Parrott
, K. L. Sinclair
, M. P Y Desmulliez

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.

Original language	English
Title of host publication	PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics
DOIs	https://doi.org/10.1109/PORTABLE-POLYTRONIC.2008.4681300
Publication status	Published - 2008
Event	2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Garmisch-Partenkirchen, Germany Duration: 17 Aug 2008 → 20 Aug 2008

Conference

Conference	2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Abbreviated title	PORTABLE-POLYTRONIC 2008
Country/Territory	Germany
City	Garmisch-Partenkirchen
Period	17/08/08 → 20/08/08

Access to Document

10.1109/PORTABLE-POLYTRONIC.2008.4681300

Cite this

Tilford, T., Bailey, C., Parrott, A. K., Sinclair, K. L., & Desmulliez, M. P. Y. (2008). Impact of assembly process technologies on electronic packaging materials. In PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics https://doi.org/10.1109/PORTABLE-POLYTRONIC.2008.4681300

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title = "Impact of assembly process technologies on electronic packaging materials",

abstract = "Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.",

author = "T. Tilford and C. Bailey and Parrott, \{A. K.\} and Sinclair, \{K. L.\} and Desmulliez, \{M. P Y\}",

year = "2008",

doi = "10.1109/PORTABLE-POLYTRONIC.2008.4681300",

language = "English",

isbn = "9781424421411",

booktitle = "PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics",

note = "2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, PORTABLE-POLYTRONIC 2008 ; Conference date: 17-08-2008 Through 20-08-2008",

}

Tilford, T, Bailey, C, Parrott, AK, Sinclair, KL & Desmulliez, MPY 2008, Impact of assembly process technologies on electronic packaging materials. in PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics. 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics, Garmisch-Partenkirchen, Germany, 17/08/08. https://doi.org/10.1109/PORTABLE-POLYTRONIC.2008.4681300

Impact of assembly process technologies on electronic packaging materials. / Tilford, T.; Bailey, C.; Parrott, A. K. et al.
PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics. 2008.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Impact of assembly process technologies on electronic packaging materials

AU - Tilford, T.

AU - Bailey, C.

AU - Parrott, A. K.

AU - Sinclair, K. L.

AU - Desmulliez, M. P Y

PY - 2008

Y1 - 2008

N2 - Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.

AB - Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.

UR - https://www.scopus.com/pages/publications/77950894349

U2 - 10.1109/PORTABLE-POLYTRONIC.2008.4681300

DO - 10.1109/PORTABLE-POLYTRONIC.2008.4681300

M3 - Conference contribution

SN - 9781424421411

BT - PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics

T2 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics

Y2 - 17 August 2008 through 20 August 2008

ER -

Tilford T, Bailey C, Parrott AK, Sinclair KL, Desmulliez MPY. Impact of assembly process technologies on electronic packaging materials. In PORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics. 2008 doi: 10.1109/PORTABLE-POLYTRONIC.2008.4681300

Impact of assembly process technologies on electronic packaging materials

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