Impact of assembly process technologies on electronic packaging materials

T. Tilford; C. Bailey; A. K. Parrott; J. Rizvi; C. Yin; K. I. Sinclair; M. P Y Desmulliez

doi:10.1109/ICEPT.2008.4607039

Impact of assembly process technologies on electronic packaging materials

T. Tilford, C. Bailey, A. K. Parrott, J. Rizvi, C. Yin, K. I. Sinclair, M. P Y Desmulliez

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

1 Citation (Scopus)

Abstract

Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package. © 2008 IEEE.

Original language	English
Title of host publication	Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008
DOIs	https://doi.org/10.1109/ICEPT.2008.4607039
Publication status	Published - 2008
Event	2008 International Conference on Electronic Packaging Technology and High Density Packaging - Pudong, Shanghai, China Duration: 28 Jul 2008 → 31 Jul 2008

Conference

Conference	2008 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated title	ICEPT-HDP 2008
Country/Territory	China
City	Pudong, Shanghai
Period	28/07/08 → 31/07/08

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10.1109/ICEPT.2008.4607039

Cite this

@inproceedings{c8f95022e7a840c3aff8393b7d356280,

title = "Impact of assembly process technologies on electronic packaging materials",

abstract = "Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package. {\textcopyright} 2008 IEEE.",

author = "T. Tilford and C. Bailey and Parrott, {A. K.} and J. Rizvi and C. Yin and Sinclair, {K. I.} and Desmulliez, {M. P Y}",

year = "2008",

doi = "10.1109/ICEPT.2008.4607039",

language = "English",

isbn = "9781424427406",

booktitle = "Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008",

note = "2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008 ; Conference date: 28-07-2008 Through 31-07-2008",

}

Tilford, T, Bailey, C, Parrott, AK, Rizvi, J, Yin, C, Sinclair, KI & Desmulliez, MPY 2008, Impact of assembly process technologies on electronic packaging materials. in Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008. 2008 International Conference on Electronic Packaging Technology and High Density Packaging, Pudong, Shanghai, China, 28/07/08. https://doi.org/10.1109/ICEPT.2008.4607039

TY - GEN

T1 - Impact of assembly process technologies on electronic packaging materials

AU - Tilford, T.

AU - Bailey, C.

AU - Parrott, A. K.

AU - Rizvi, J.

AU - Yin, C.

AU - Sinclair, K. I.

AU - Desmulliez, M. P Y

PY - 2008

Y1 - 2008

N2 - Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package. © 2008 IEEE.

AB - Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package. © 2008 IEEE.

U2 - 10.1109/ICEPT.2008.4607039

DO - 10.1109/ICEPT.2008.4607039

M3 - Conference contribution

SN - 9781424427406

BT - Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008

T2 - 2008 International Conference on Electronic Packaging Technology and High Density Packaging

Y2 - 28 July 2008 through 31 July 2008

ER -

Impact of assembly process technologies on electronic packaging materials

Abstract

Conference

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