Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss the impact of traditional reflow based processes on flexible substrates and it will demonstrate the possible advantages of using localised variable frequency microwave heating to cure materials in an electronic package. © 2008 IEEE.
|Title of host publication||Proceedings, 2008 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2008|
|Publication status||Published - 2008|
|Event||2008 International Conference on Electronic Packaging Technology and High Density Packaging - Pudong, Shanghai, China|
Duration: 28 Jul 2008 → 31 Jul 2008
|Conference||2008 International Conference on Electronic Packaging Technology and High Density Packaging|
|Abbreviated title||ICEPT-HDP 2008|
|Period||28/07/08 → 31/07/08|