Impact of assembly process technologies on electronic packaging materials

T. Tilford, C. Bailey, A. K. Parrott, K. L. Sinclair, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Assembly processes used to bond components to printed circuit boards can have a significant impact on these boards and the final packaged component. Traditional approaches to bonding components to printed circuit boards results in heat being applied across the whole board assembly. This can lead to board warpage and possibly high residual stresses. Another approach discussed in this paper is to use Variable Frequency Microwave (VFM) heating to cure adhesives and underfills and bond components to printed circuit boards. In terms of energy considerations the use of VFM technology is much more cost effective compared to convection/radiation heating. This paper will discuss modelling results for microwave curing of polymer materials used in electronic packaging.

Original languageEnglish
Title of host publicationPORTABLE-POLYTRONIC 2008 - 2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conf. Polymers and Adhesives in Microelectronics and Photonics
DOIs
Publication statusPublished - 2008
Event2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics - Garmisch-Partenkirchen, Germany
Duration: 17 Aug 200820 Aug 2008

Conference

Conference2nd IEEE International Interdisciplinary Conference on Portable Information Devices and the 2008 7th IEEE Conference on Polymers and Adhesives in Microelectronics and Photonics
Abbreviated titlePORTABLE-POLYTRONIC 2008
CountryGermany
CityGarmisch-Partenkirchen
Period17/08/0820/08/08

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