Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Qiang Wu, Norbert Lorenz, Kevin Cannon, Changhai Wang, Andrew J. Moore, Duncan P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper we investigate and compare a laser-driven joining process with two different illumination conditions: (i) high speed scanning of a focused beam and (ii) reasonably uniform "flood illumination" of the whole sample. It is shown that the scanning beam not only avoids illuminating the central part of the device, but also provides more uniform heating of the area to be bonded than laser "flood illumination". We demonstrate bonding of three different packages: (i) LCC (Leadless chip carrier) packages, (ii) AlN and (iii) LTCC (Low temperature co-fired ceramic) substrates to "top-hat" packages, using a scanned beam from a fibre-delivered high power laser diode array to cure an intermediate layer of glass frit. Standard leak testing demonstrates that all those samples have excellent hermetic sealing with leak rates at the level of 10-9 atm.cc/s.

Original languageEnglish
Title of host publicationICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics, Congress Proceedings
Pages122-131
Number of pages10
Publication statusPublished - 2008
EventICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics - Temecula, CA, United States
Duration: 20 Oct 200823 Oct 2008

Conference

ConferenceICALEO 2008 - 27th International Congress on Applications of Lasers and Electro-Optics
Country/TerritoryUnited States
CityTemecula, CA
Period20/10/0823/10/08

Keywords

  • Glass frit
  • Laser joining

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