Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam

Qiang Wu, Norbert Lorenz, Kevin Cannon, Changhai Wang, Andrew J. Moore, Duncan P. Hand

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

In this paper we investigate and compare a laser-driven joining process with two different illumination conditions: (i) high speed scanning of a focused beam and (ii) reasonably uniform "flood illumination" of the whole sample. It is shown that the scanning beam not only avoids illuminating the central part of the device, but also provides more uniform heating of the area to be bonded than laser "flood illumination". We demonstrate bonding of three different packages: (i) LCC (Leadless chip carrier) packages, (ii) AIN and (iii) LTCC (Low temperature co-fired ceramic) substrates to "top-hat" packages, using a scanned beam from a fibre-delivered high power laser diode array to cure an intermediate layer of glass frit. Standard leak testing demonstrates that all those samples have excellent hermetic sealing with leak rates at the level of 10-9 atm·cc/s. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages669-677
Number of pages9
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

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  • Cite this

    Wu, Q., Lorenz, N., Cannon, K., Wang, C., Moore, A. J., & Hand, D. P. (2008). Hermetic joining of micro-devices using a glass frit intermediate layer and a scanning laser beam. In Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC (pp. 669-677) https://doi.org/10.1109/ESTC.2008.4684431