Hermetic glass frit packaging in air and vacuum with localized laser joining

N. Lorenz, S. Millar, M. Desmulliez, D. P. Hand

Research output: Contribution to journalArticlepeer-review

17 Citations (Scopus)


Glass frit packaging is a simple and robust method used for hermetic sealing of micro-devices. Conventional glass frit packaging processes rely on furnace heating where the entire package is heated to elevated temperatures, hence restricting the use of temperature-sensitive materials inside the package and generating problems in multi-stage packaging processes. The use of a laser as an alternative heat source offers the possibility of highly localized heating where the heat-input can be restricted to the joining area only. In this paper the clear benefits of combining glass frit packaging and localized laser heating are demonstrated. Two novel laser-based glass frit packaging processes for sealing of leadless chip carrier (LCC) packages in both air and vacuum have been developed. Full hermetic seals according to MIL-STD-883G are achieved in high yield processes where the temperature in the centre of the device is kept at least 230 °C below the temperature in the joining region. © 2011 IOP Publishing Ltd.

Original languageEnglish
Article number045039
JournalJournal of Micromechanics and Microengineering
Issue number4
Publication statusPublished - Apr 2011


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