Growth and recrystallization of electroplated copper columns

Jun Liu, Changqing Liu, Paul P. Conway, Jun Zeng, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The present paper addresses the formation and evolution of microstructure and crystal structure of electroplated copper columns. Copper columns of different size have been plated on Au seed layer for a series of periods of time from half an hour to three hours and characterized by Focused Ion Beam (FIB) and XRD. It was found that not only the growth process during plating but also accompanying recrystallization and post-plating spontaneous self-annealing account for the interesting microstructure with bi-modal or tri-modal grain size distribution. The evolution of crystal structure of the copper columns during plating and self-annealing after plating was also studied and discussed. The results indicate that the presence of organic additives is not essential for selfannealing to occur in copper columns, which is against the popular belief with respect to electroplated copper films. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages695-700
Number of pages6
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

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    Liu, J., Liu, C., Conway, P. P., Zeng, J., & Wang, C. (2009). Growth and recrystallization of electroplated copper columns. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 695-700) https://doi.org/10.1109/ICEPT.2009.5270660