Fully Embedded Ultra-Wideband Multilayer Balun into Organic Packaging Substrate

Khaled Aliqab, Jiasheng Hong

Research output: Contribution to journalArticle

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Abstract

This study presents a novel miniaturised ultra-wideband (UWB) multilayer balun embedded into organic packaging substrate of liquid crystal polymer. The broadside coupled stripline structure is adopted in this work to realise UWB performance and TEM mode. The fabricated prototype is self-packaged for electromagnetic shielding, and lightweight, with a small footprint. The proposed balun design achieves excellent amplitude and phase balances within the entire bandwidth, centred at 6.2 GHz. Simulation and measurement results show very good agreement.

Original languageEnglish
Pages (from-to)322-325
Number of pages4
JournalIET Microwaves, Antennas and Propagation
Volume13
Issue number3
Early online date30 Nov 2018
DOIs
Publication statusPublished - 27 Feb 2019

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Ultra-wideband (UWB)
Packaging
Multilayers
Electromagnetic shielding
Liquid crystal polymers
Substrates
Transmission electron microscopy
Bandwidth

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

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Fully Embedded Ultra-Wideband Multilayer Balun into Organic Packaging Substrate. / Aliqab, Khaled; Hong, Jiasheng.

In: IET Microwaves, Antennas and Propagation, Vol. 13, No. 3, 27.02.2019, p. 322-325.

Research output: Contribution to journalArticle

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