Abstract
With the development of micro- and nanotechnological products such as sensors, MEMS and NEMS and their broad application new reliability issues will arise. The authors present a combined experimental and simulative approach targeted on unsolved questions of size effects within newly developed nanomaterials and highly integrated systems. The experimental approach is based on in-situ SPM scans of the analyzed object carried out at different thermomechanical load states. With the application of digital image correlation techniques displacement fields with nanometer accuracy are derived. A simulative approaches is performed by homogenization which is the modeling of a representative volume of bulk material taking into account spatial distribution of filler particles. The results of the homogenization are input data for standard finite element codes. © 2004 IEEE.
Original language | English |
---|---|
Title of host publication | 2004 4th IEEE Conference on Nanotechnology |
Pages | 186-188 |
Number of pages | 3 |
Publication status | Published - 2004 |
Event | 2004 4th IEEE Conference on Nanotechnology - Munich, Germany Duration: 16 Aug 2004 → 19 Aug 2004 |
Conference
Conference | 2004 4th IEEE Conference on Nanotechnology |
---|---|
Country/Territory | Germany |
City | Munich |
Period | 16/08/04 → 19/08/04 |
Keywords
- Nano deformation analysis