Flip chip assembly of MEMS inductors

A J Pang, Changhai Wang, Alan John Sangster

Research output: Contribution to conferencePaper

Original languageEnglish
Pages298-300
Number of pages3
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

Cite this

Pang, A. J., Wang, C., & Sangster, A. J. (2003). Flip chip assembly of MEMS inductors. 298-300. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.
Pang, A J ; Wang, Changhai ; Sangster, Alan John. / Flip chip assembly of MEMS inductors. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.3 p.
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title = "Flip chip assembly of MEMS inductors",
author = "Pang, {A J} and Changhai Wang and Sangster, {Alan John}",
year = "2003",
month = "12",
language = "English",
pages = "298--300",
note = "5th Electronics Packaging Technology Conference, EPTC 2003 ; Conference date: 01-01-2003",

}

Pang, AJ, Wang, C & Sangster, AJ 2003, 'Flip chip assembly of MEMS inductors', Paper presented at 5th Electronics Packaging Technology Conference, Singapore, 1/01/03 pp. 298-300.

Flip chip assembly of MEMS inductors. / Pang, A J; Wang, Changhai; Sangster, Alan John.

2003. 298-300 Paper presented at 5th Electronics Packaging Technology Conference, Singapore.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Flip chip assembly of MEMS inductors

AU - Pang, A J

AU - Wang, Changhai

AU - Sangster, Alan John

PY - 2003/12

Y1 - 2003/12

M3 - Paper

SP - 298

EP - 300

ER -

Pang AJ, Wang C, Sangster AJ. Flip chip assembly of MEMS inductors. 2003. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.