Flip chip assembly of MEMS inductors

A J Pang, Changhai Wang, Alan John Sangster

Research output: Contribution to conferencePaper

Original languageEnglish
Pages298-300
Number of pages3
Publication statusPublished - Dec 2003
Event5th Electronics Packaging Technology Conference - , Singapore
Duration: 1 Jan 2003 → …

Conference

Conference5th Electronics Packaging Technology Conference
Abbreviated titleEPTC 2003
CountrySingapore
Period1/01/03 → …

Cite this

Pang, A. J., Wang, C., & Sangster, A. J. (2003). Flip chip assembly of MEMS inductors. 298-300. Paper presented at 5th Electronics Packaging Technology Conference, Singapore.