Flip chip assembled MEMS inductors

J. Zeng; A. J. Pang; C. H. Wang; A. J. Sangster

doi:10.1049/el:20050153

Flip chip assembled MEMS inductors

J. Zeng, A. J. Pang, C. H. Wang, A. J. Sangster

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

10 Citations (Scopus)

Abstract

High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 µm between the inductor structure and the substrate. The inductance of the device was measured to be ~2 nH and a maximum Q-factor of 19 at ~2.5 GHz was obtained after pad/connector de-embedding. © IEE 2005.

Original language	English
Pages (from-to)	480-481
Number of pages	2
Journal	Electronics Letters
Volume	41
Issue number	8
DOIs	https://doi.org/10.1049/el:20050153
Publication status	Published - 14 Apr 2005

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@article{d516a6ff5fad4f05b42ce1ac83ed6b55,

title = "Flip chip assembled MEMS inductors",

abstract = "High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 µm between the inductor structure and the substrate. The inductance of the device was measured to be ~2 nH and a maximum Q-factor of 19 at ~2.5 GHz was obtained after pad/connector de-embedding. {\textcopyright} IEE 2005.",

author = "J. Zeng and Pang, {A. J.} and Wang, {C. H.} and Sangster, {A. J.}",

year = "2005",

month = apr,

day = "14",

doi = "10.1049/el:20050153",

language = "English",

volume = "41",

pages = "480--481",

journal = "Electronics Letters",

issn = "1350-911X",

publisher = "Institution of Engineering and Technology",

number = "8",

}

TY - JOUR

T1 - Flip chip assembled MEMS inductors

AU - Zeng, J.

AU - Pang, A. J.

AU - Wang, C. H.

AU - Sangster, A. J.

PY - 2005/4/14

Y1 - 2005/4/14

N2 - High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 µm between the inductor structure and the substrate. The inductance of the device was measured to be ~2 nH and a maximum Q-factor of 19 at ~2.5 GHz was obtained after pad/connector de-embedding. © IEE 2005.

AB - High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 µm between the inductor structure and the substrate. The inductance of the device was measured to be ~2 nH and a maximum Q-factor of 19 at ~2.5 GHz was obtained after pad/connector de-embedding. © IEE 2005.

UR - http://www.scopus.com/inward/record.url?scp=18144406168&partnerID=8YFLogxK

U2 - 10.1049/el:20050153

DO - 10.1049/el:20050153

M3 - Article

SN - 1350-911X

VL - 41

SP - 480

EP - 481

JO - Electronics Letters

JF - Electronics Letters

IS - 8

ER -

Flip chip assembled MEMS inductors

Abstract

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