Flip chip assembled MEMS inductors

J. Zeng, A. J. Pang, C. H. Wang, A. J. Sangster

Research output: Contribution to journalArticlepeer-review

10 Citations (Scopus)


High performance suspended MEMS inductors produced using a flip chip assembly approach are described. An inductor structure is fabricated on a carrier and then flip chip assembled onto a substrate to form a suspended inductor for RF-IC applications with significant improvement in Q-factor and frequency of operation over the conventional IC inductors. A spiral MEMS inductor has been successfully produced on a silicon substrate with an air gap of 26 µm between the inductor structure and the substrate. The inductance of the device was measured to be ~2 nH and a maximum Q-factor of 19 at ~2.5 GHz was obtained after pad/connector de-embedding. © IEE 2005.

Original languageEnglish
Pages (from-to)480-481
Number of pages2
JournalElectronics Letters
Issue number8
Publication statusPublished - 14 Apr 2005


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