Fabrication of high power RF MEMS switches

Ling Wang; Zheng Cui; Jia Sheng Hong; Eamon P. McErlean; Robert B. Greed; Daniel C. Voyce

doi:10.1016/j.mee.2006.01.067

Fabrication of high power RF MEMS switches

Ling Wang, Zheng Cui, Jia Sheng Hong, Eamon P. McErlean, Robert B. Greed, Daniel C. Voyce

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

23 Citations (Scopus)

Abstract

High power RF MEMS switches have been designed and fabricated. The switches are composed of a matrix of ohmic contact cantilevers and bridges. Optimized fabrication processes have been developed to improve planarization on contact surface and reduce residual stress in switch beams, which ensure a reasonable flat and smooth cantilever and membrane bridge for operation at high RF power and low actuation voltage. Crown Copyright © 2006.

Original language	English
Pages (from-to)	1418-1420
Number of pages	3
Journal	Microelectronic Engineering
Volume	83
Issue number	4-9 SPEC. ISS.
DOIs	https://doi.org/10.1016/j.mee.2006.01.067
Publication status	Published - Apr 2006

Keywords

Membrane residual stress
MEMS
Planarization
RF switches

Access to Document

10.1016/j.mee.2006.01.067

Cite this

@article{5b1ec37f9c8b4e8e90d8a8a30fd8c8f2,

title = "Fabrication of high power RF MEMS switches",

abstract = "High power RF MEMS switches have been designed and fabricated. The switches are composed of a matrix of ohmic contact cantilevers and bridges. Optimized fabrication processes have been developed to improve planarization on contact surface and reduce residual stress in switch beams, which ensure a reasonable flat and smooth cantilever and membrane bridge for operation at high RF power and low actuation voltage. Crown Copyright {\textcopyright} 2006.",

keywords = "Membrane residual stress, MEMS, Planarization, RF switches",

author = "Ling Wang and Zheng Cui and Hong, \{Jia Sheng\} and McErlean, \{Eamon P.\} and Greed, \{Robert B.\} and Voyce, \{Daniel C.\}",

year = "2006",

month = apr,

doi = "10.1016/j.mee.2006.01.067",

language = "English",

volume = "83",

pages = "1418--1420",

journal = "Microelectronic Engineering",

issn = "0167-9317",

publisher = "Elsevier B.V.",

number = "4-9 SPEC. ISS.",

}

TY - JOUR

T1 - Fabrication of high power RF MEMS switches

AU - Wang, Ling

AU - Cui, Zheng

AU - Hong, Jia Sheng

AU - McErlean, Eamon P.

AU - Greed, Robert B.

AU - Voyce, Daniel C.

PY - 2006/4

Y1 - 2006/4

N2 - High power RF MEMS switches have been designed and fabricated. The switches are composed of a matrix of ohmic contact cantilevers and bridges. Optimized fabrication processes have been developed to improve planarization on contact surface and reduce residual stress in switch beams, which ensure a reasonable flat and smooth cantilever and membrane bridge for operation at high RF power and low actuation voltage. Crown Copyright © 2006.

AB - High power RF MEMS switches have been designed and fabricated. The switches are composed of a matrix of ohmic contact cantilevers and bridges. Optimized fabrication processes have been developed to improve planarization on contact surface and reduce residual stress in switch beams, which ensure a reasonable flat and smooth cantilever and membrane bridge for operation at high RF power and low actuation voltage. Crown Copyright © 2006.

KW - Membrane residual stress

KW - MEMS

KW - Planarization

KW - RF switches

UR - https://www.scopus.com/pages/publications/33646044084

U2 - 10.1016/j.mee.2006.01.067

DO - 10.1016/j.mee.2006.01.067

M3 - Article

SN - 0167-9317

VL - 83

SP - 1418

EP - 1420

JO - Microelectronic Engineering

JF - Microelectronic Engineering

IS - 4-9 SPEC. ISS.

ER -

Fabrication of high power RF MEMS switches

Abstract

Keywords

Access to Document

Other files and links

Fingerprint

Cite this