Fabrication of Fully Inkjet-Printed Vias and SIW Structures on Thick Polymer Substrates

Sangkil Kim, Atif Shamim, Apostolos Georgiadis, Hervé Aubert, Manos M. Tentzeris

Research output: Contribution to journalArticle

29 Citations (Scopus)

Abstract

In this paper, a novel fully inkjet-printed via fabrication technology and various inkjet-printed substrate-integrated waveguide (SIW) structures on thick polymer substrates are presented. The electrical properties of polymethyl methacrylate (PMMA) are thoroughly studied up to 8 GHz utilizing the T-resonator method, and inkjet-printable silver nanoparticle ink on PMMA is characterized. A long via fabrication process up to 1 mm utilizing inkjet-printing technology is demonstrated, and its characteristics are presented for the first time. The inkjet-printed vias on 0.8-mm-thick substrate have a resistance of similar to 0.2 Omega. An equivalent circuit model of the inkjet-printed stepped vias is also discussed. An inkjet-printed microstrip-to-SIW interconnect and an SIW cavity resonator utilizing the proposed inkjet-printed via fabrication process are also presented. The design of the components and the fabrication steps are discussed, and the measured performances over the microwave frequency range of the prototypes are presented.

Original languageEnglish
Pages (from-to)486-496
Number of pages11
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Volume6
Issue number3
DOIs
Publication statusPublished - Mar 2016

Keywords

  • Additive fabrication
  • inkjet-printed substrate-integrated waveguide (SIW)
  • inkjet-printed via
  • low-cost via fabrication
  • polymethyl methacrylate (PMMA)
  • INTEGRATED WAVE-GUIDE
  • PAPER SUBSTRATE
  • SILVER TRACKS
  • CIRCUITS
  • ANTENNAS
  • TECHNOLOGY
  • MICROSTRIP
  • DROPLET
  • SENSOR

Cite this