Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

M. P Y Desmulliez; A. J. Pang; M. Leonard; R. S. Dhariwal; W. Yu; E. Abraham; Gy Bognár; A. Poppe; Gy Horvath; Zs Kohari; M. Rencz; D. Emerson; R. W. Barber; O. Slattery; F. Waldron; N. Cordero

doi:10.1109/TCAPT.2008.2002434

Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

M. P Y Desmulliez, A. J. Pang, M. Leonard, R. S. Dhariwal, W. Yu, E. Abraham, Gy Bognár, A. Poppe, Gy Horvath, Zs Kohari, M. Rencz, D. Emerson, R. W. Barber, O. Slattery, F. Waldron, N. Cordero

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

11 Citations (Scopus)

Abstract

The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-µm width and 70-µm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m² K have been measured for a nitrogen flow rate of 120 l/h. © 2009 IEEE.

Original language	English
Pages (from-to)	20-29
Number of pages	10
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	32
Issue number	1
DOIs	https://doi.org/10.1109/TCAPT.2008.2002434
Publication status	Published - 2009

Keywords

Cooling devices
Microchannel
Modeling and simulation
Thermal management
UV-LIGA

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10.1109/TCAPT.2008.2002434

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Desmulliez, M. P. Y., Pang, A. J., Leonard, M., Dhariwal, R. S., Yu, W., Abraham, E., Bognár, G., Poppe, A., Horvath, G., Kohari, Z., Rencz, M., Emerson, D., Barber, R. W., Slattery, O., Waldron, F., & Cordero, N. (2009). Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate. IEEE Transactions on Components and Packaging Technologies, 32(1), 20-29. https://doi.org/10.1109/TCAPT.2008.2002434

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title = "Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate",

abstract = "The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-µm width and 70-µm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m2 K have been measured for a nitrogen flow rate of 120 l/h. {\textcopyright} 2009 IEEE.",

keywords = "Cooling devices, Microchannel, Modeling and simulation, Thermal management, UV-LIGA",

author = "Desmulliez, {M. P Y} and Pang, {A. J.} and M. Leonard and Dhariwal, {R. S.} and W. Yu and E. Abraham and Gy Bogn{\'a}r and A. Poppe and Gy Horvath and Zs Kohari and M. Rencz and D. Emerson and Barber, {R. W.} and O. Slattery and F. Waldron and N. Cordero",

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Desmulliez, MPY, Pang, AJ, Leonard, M, Dhariwal, RS, Yu, W, Abraham, E, Bognár, G, Poppe, A, Horvath, G, Kohari, Z, Rencz, M, Emerson, D, Barber, RW, Slattery, O, Waldron, F & Cordero, N 2009, 'Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate', IEEE Transactions on Components and Packaging Technologies, vol. 32, no. 1, pp. 20-29. https://doi.org/10.1109/TCAPT.2008.2002434

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T1 - Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

AU - Desmulliez, M. P Y

AU - Pang, A. J.

AU - Leonard, M.

AU - Dhariwal, R. S.

AU - Yu, W.

AU - Abraham, E.

AU - Bognár, Gy

AU - Poppe, A.

AU - Horvath, Gy

AU - Kohari, Zs

AU - Rencz, M.

AU - Emerson, D.

AU - Barber, R. W.

AU - Slattery, O.

AU - Waldron, F.

AU - Cordero, N.

PY - 2009

Y1 - 2009

N2 - The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-µm width and 70-µm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m2 K have been measured for a nitrogen flow rate of 120 l/h. © 2009 IEEE.

AB - The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-µm width and 70-µm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m2 K have been measured for a nitrogen flow rate of 120 l/h. © 2009 IEEE.

KW - Cooling devices

KW - Microchannel

KW - Modeling and simulation

KW - Thermal management

KW - UV-LIGA

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DO - 10.1109/TCAPT.2008.2002434

M3 - Article

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VL - 32

SP - 20

EP - 29

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 1

ER -

Fabrication and characterization of a low-cost, wafer-scale radial microchannel cooling plate

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Keywords

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