The modeling, simulation, fabrication, and testing of a microchannel cooling plate for microelectronic packaging applications are described in this paper. The cooling component uses forced convection of gas injected inside 128 microchannels of 100-µm width and 70-µm height. The nickel-based plate is fabricated on a glass substrate using a two-layer electroforming process using UV-LIGA technology. The thermal behavior of the microchannel cooling device is investigated by using the measurement of partial thermal resistances through the use of the structure functions method. Heat transfer coefficient values of 300 W/ m2 K have been measured for a nitrogen flow rate of 120 l/h. © 2009 IEEE.
|Number of pages||10|
|Journal||IEEE Transactions on Components and Packaging Technologies|
|Publication status||Published - 2009|
- Cooling devices
- Modeling and simulation
- Thermal management