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Extreme environment interconnects and packaging for power electronics
Alberto Campos-Zatarain
, Jack Hinton
, Maria Mirgkizoudi
, Jing Li
, Russell Harris
, Robert W. Kay
,
David Flynn
Institute of Sensors, Signals & Systems
School of Engineering & Physical Sciences
Research output
:
Contribution to journal
›
Conference article
›
peer-review
127
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INIS
additives
20%
applications
40%
ceramics
100%
chains
20%
deposition
20%
diffusion
40%
environment
100%
extrusion
20%
flashing
20%
gas oils
20%
geometry
20%
industry
20%
liquids
40%
loading
60%
manufacturing
20%
masks
20%
motion
20%
nozzles
20%
packaging
100%
power
100%
randomness
20%
solids
40%
substrates
80%
surfaces
20%
vehicles
20%
viscosity
20%
Engineering
555 Timer
33%
Additive Manufacturing
33%
Bond Strength
33%
Component Surface
33%
Dedicated Tooling
33%
Electronic Circuitry
33%
Frequency Vibration
33%
Interconnects
100%
Interdiffusion
66%
Mechanical Loading
33%
Petroleum Industry
33%
Power Electronics
100%
Process Chain
33%
Test Vehicle
33%