Extreme environment interconnects and packaging for power electronics

Alberto Campos-Zatarain, Jack Hinton, Maria Mirgkizoudi, Jing Li, Russell Harris, Robert W. Kay, David Flynn

Research output: Contribution to journalConference article

Abstract

This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.
LanguageEnglish
JournalJournal of Engineering
Early online date15 Apr 2019
DOIs
Publication statusE-pub ahead of print - 15 Apr 2019

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Power electronics
Packaging
Interdiffusion (solids)
Substrates
Printing
3D printers
Networks (circuits)
Bond strength (materials)
Gas industry
Liquids
Light emitting diodes
Extrusion
Masks
Nozzles
Viscosity
Geometry
Hot Temperature

Cite this

Campos-Zatarain, Alberto ; Hinton, Jack ; Mirgkizoudi, Maria ; Li, Jing ; Harris, Russell ; Kay, Robert W. ; Flynn, David. / Extreme environment interconnects and packaging for power electronics. In: Journal of Engineering. 2019.
@article{c4e7b7cdec364290b37aa4980aac0dc7,
title = "Extreme environment interconnects and packaging for power electronics",
abstract = "This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.",
author = "Alberto Campos-Zatarain and Jack Hinton and Maria Mirgkizoudi and Jing Li and Russell Harris and Kay, {Robert W.} and David Flynn",
year = "2019",
month = "4",
day = "15",
doi = "10.1049/joe.2018.8118",
language = "English",
journal = "Journal of Engineering",
issn = "2051-3305",
publisher = "Institution of Engineering and Technology",

}

Extreme environment interconnects and packaging for power electronics. / Campos-Zatarain, Alberto; Hinton, Jack; Mirgkizoudi, Maria; Li, Jing; Harris, Russell; Kay, Robert W.; Flynn, David.

In: Journal of Engineering, 15.04.2019.

Research output: Contribution to journalConference article

TY - JOUR

T1 - Extreme environment interconnects and packaging for power electronics

AU - Campos-Zatarain, Alberto

AU - Hinton, Jack

AU - Mirgkizoudi, Maria

AU - Li, Jing

AU - Harris, Russell

AU - Kay, Robert W.

AU - Flynn, David

PY - 2019/4/15

Y1 - 2019/4/15

N2 - This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.

AB - This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.

U2 - 10.1049/joe.2018.8118

DO - 10.1049/joe.2018.8118

M3 - Conference article

JO - Journal of Engineering

T2 - Journal of Engineering

JF - Journal of Engineering

SN - 2051-3305

ER -

Campos-Zatarain A, Hinton J, Mirgkizoudi M, Li J, Harris R, Kay RW et al. Extreme environment interconnects and packaging for power electronics. Journal of Engineering. 2019 Apr 15. https://doi.org/10.1049/joe.2018.8118