Extreme Environment Interconnects and Packaging for Power Electronics

David Flynn, Alberto Campos Zatarain, Robert W. Kay, Russell A. Harris, M. Mirgkizoudi

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Abstract—This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.
Original languageEnglish
Title of host publication2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD)
PublisherInstitution of Engineering and Technology
Number of pages6
Publication statusAccepted/In press - 14 Feb 2018
Event9th International Conference on Power Electronics, Machines and Drives 2018 - Liverpool ACC, Liverpool, United Kingdom
Duration: 17 Apr 201819 Apr 2018
https://events.theiet.org/pemd/

Conference

Conference9th International Conference on Power Electronics, Machines and Drives 2018
Abbreviated titlePEMD 2018
CountryUnited Kingdom
CityLiverpool
Period17/04/1819/04/18
Internet address

Fingerprint

Power electronics
Packaging
Interdiffusion (solids)
Substrates
Printing
3D printers
Networks (circuits)
Bond strength (materials)
Gas industry
Liquids
Light emitting diodes
Extrusion
Masks
Nozzles
Viscosity
Geometry
Hot Temperature

Keywords

  • additive manufacturing
  • interconnect
  • Packaging
  • bonding
  • harsh environment
  • high temperature

Cite this

Flynn, D., Campos Zatarain, A., Kay, R. W., Harris, R. A., & Mirgkizoudi, M. (Accepted/In press). Extreme Environment Interconnects and Packaging for Power Electronics. In 2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD) Institution of Engineering and Technology.
Flynn, David ; Campos Zatarain, Alberto ; Kay, Robert W. ; Harris, Russell A. ; Mirgkizoudi, M. / Extreme Environment Interconnects and Packaging for Power Electronics. 2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD). Institution of Engineering and Technology, 2018.
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title = "Extreme Environment Interconnects and Packaging for Power Electronics",
abstract = "Abstract—This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.",
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author = "David Flynn and {Campos Zatarain}, Alberto and Kay, {Robert W.} and Harris, {Russell A.} and M. Mirgkizoudi",
note = "Dear David, Your submission titled {"}Extreme Environment Interconnects and Packaging for Power Electronics{"} and reference number 0335 has been accepted as an Poster presentation for PEMD 2018. Every paper must have at least one author registered to attend the conference by Wednesday 14 March 2018, student authors must have their registration endorsed by a Professor. If a paper does not have an author registered by the deadline then the submission will be removed from the conference programme and the proceedings.",
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booktitle = "2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD)",
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Flynn, D, Campos Zatarain, A, Kay, RW, Harris, RA & Mirgkizoudi, M 2018, Extreme Environment Interconnects and Packaging for Power Electronics. in 2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD). Institution of Engineering and Technology, 9th International Conference on Power Electronics, Machines and Drives 2018, Liverpool, United Kingdom, 17/04/18.

Extreme Environment Interconnects and Packaging for Power Electronics. / Flynn, David; Campos Zatarain, Alberto; Kay, Robert W.; Harris, Russell A.; Mirgkizoudi, M.

2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD). Institution of Engineering and Technology, 2018.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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T1 - Extreme Environment Interconnects and Packaging for Power Electronics

AU - Flynn, David

AU - Campos Zatarain, Alberto

AU - Kay, Robert W.

AU - Harris, Russell A.

AU - Mirgkizoudi, M.

N1 - Dear David, Your submission titled "Extreme Environment Interconnects and Packaging for Power Electronics" and reference number 0335 has been accepted as an Poster presentation for PEMD 2018. Every paper must have at least one author registered to attend the conference by Wednesday 14 March 2018, student authors must have their registration endorsed by a Professor. If a paper does not have an author registered by the deadline then the submission will be removed from the conference programme and the proceedings.

PY - 2018/2/14

Y1 - 2018/2/14

N2 - Abstract—This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.

AB - Abstract—This paper presents the combination of an innovative assembly and packaging process utilising Solid Liquid Inter Diffusion (SLID) Cu-Sn interconnects within bespoke ceramic substrates that have been produced using Additive Manufacturing (AM). The resultant process chain supports the integration and packaging of power electronics for harsh environment applications. In this work, we investigate how the bond strength and mechanical integrity of Cu-Sn SLID interconnects are affected after being exposed concurrently to vibration and thermal loading (“shake and bake test”) . Test vehicles were exposed simultaneously to thermal loading up to 300 °C and mechanical loading in terms of high random frequency vibration between 1 Hz and 2000 Hz, which is closely associated with the aerospace and oil & gas industries maximum operating conditions. In parallel micro-extrusion printing methods in which high viscosity ceramic pastes are dispensed through cylindrical fine nozzles (2-250µm) using CNC controlled motion has enabled complex 3D geometries to be fabricated. Additional secondary conductor deposition after firing the ceramic substrate enables the electronic circuitry to be generated without dedicated tooling, masks or templates. This work presents the first fully 3D printed ceramic based electronic substrates. To demonstrate the applications of this printing method a 555 timer circuit with flashing LED has been printed and the components surface mount assembled. The resultant ceramic substrates are dense, mechanically robust and the reflowed circuit functions exactly as intended.

KW - additive manufacturing

KW - interconnect

KW - Packaging

KW - bonding

KW - harsh environment

KW - high temperature

M3 - Conference contribution

BT - 2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD)

PB - Institution of Engineering and Technology

ER -

Flynn D, Campos Zatarain A, Kay RW, Harris RA, Mirgkizoudi M. Extreme Environment Interconnects and Packaging for Power Electronics. In 2018 IET 9th International Conference on Power Electronics, Machines & Drives (PEMD). Institution of Engineering and Technology. 2018