Experimental up-scaling of thermal conductivity reductions in silicon by vacancy-engineering: From the nano- to the micro-scale

Neil M. Wight, Nick S. Bennett

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Abstract

A method to reduce the thermal conductivity in Si thin-films by at least an order of magnitude is shown, successfully demonstrating the up-scaling of this technique from Si nano-films. High energy self implantation of Si is used to create a supersaturation of lattice vacancy concentrations that remain following post implant rapid thermal annealing producing a disruption in phonon mode thermal transport. This method demonstrates an approach for micro-harvesting thermoelectric device applications without the difficulties faced for dimensional up-scaling in alternative Si thermoelectric approaches. Challenges surrounding the thermal budget required for post implant dopant activation in p-type Si are also shown.
Original languageEnglish
Pages (from-to)10211-10217
Number of pages7
JournalMaterials Today: Proceedings
Volume5
Issue number4, Part 1
Early online date22 May 2018
DOIs
Publication statusPublished - 2018
Event14th European Conference on Thermoelectrics 2016 - Lisbon, Portugal
Duration: 20 Sept 201623 Sept 2016

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