Experimental study of a radial micro-channel cooling plate

A. Poppe, Gy Horváth, Gy Bognár, Zs Kohári, M. P Y Desmulliez, M. Rencz

Research output: Chapter in Book/Report/Conference proceedingConference contribution

7 Citations (Scopus)


The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained (1) from the identified thermal resistance value and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found. ©2005 IEEE.

Original languageEnglish
Title of host publicationProceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Number of pages6
Publication statusPublished - 2005
Event7th Electronics Packaging Technology Conference - Singapore, Singapore
Duration: 7 Dec 20059 Dec 2005


Conference7th Electronics Packaging Technology Conference
Abbreviated title EPTC 2005


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