Experimental study of a radial micro-channel cooling plate

A. Poppe; Gy Horváth; Gy Bognár; Zs Kohári; M. P Y Desmulliez; M. Rencz

Experimental study of a radial micro-channel cooling plate

A. Poppe, Gy Horváth, Gy Bognár, Zs Kohári, M. P Y Desmulliez, M. Rencz

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

7 Citations (Scopus)

Abstract

The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained (1) from the identified thermal resistance value and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found. ©2005 IEEE.

Original language	English
Title of host publication	Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005
Pages	664-669
Number of pages	6
Volume	2
Publication status	Published - 2005
Event	7th Electronics Packaging Technology Conference - Singapore, Singapore Duration: 7 Dec 2005 → 9 Dec 2005

Conference

Conference	7th Electronics Packaging Technology Conference
Abbreviated title	EPTC 2005
Country/Territory	Singapore
City	Singapore
Period	7/12/05 → 9/12/05

Cite this

@inproceedings{f493e4c153d34e63a3560a488901029a,

title = "Experimental study of a radial micro-channel cooling plate",

abstract = "The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained (1) from the identified thermal resistance value and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found. {\textcopyright}2005 IEEE.",

author = "A. Poppe and Gy Horv{\'a}th and Gy Bogn{\'a}r and Zs Koh{\'a}ri and Desmulliez, {M. P Y} and M. Rencz",

year = "2005",

language = "English",

isbn = "0780395786",

volume = "2",

pages = "664--669",

booktitle = "Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005",

note = "7th Electronics Packaging Technology Conference, EPTC 2005 ; Conference date: 07-12-2005 Through 09-12-2005",

}

TY - GEN

T1 - Experimental study of a radial micro-channel cooling plate

AU - Poppe, A.

AU - Horváth, Gy

AU - Bognár, Gy

AU - Kohári, Zs

AU - Desmulliez, M. P Y

AU - Rencz, M.

PY - 2005

Y1 - 2005

N2 - The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained (1) from the identified thermal resistance value and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found. ©2005 IEEE.

AB - The thermal behavior of a micro-channel cooling device has been investigated by using two different, complementary measurement methods. The measured sample was a square nickel plate micro-cooler holding 128 micro-channels in radial arrangement. In our previous studies we used only thermal transient measurements and the structure functions method to identify the partial thermal resistance corresponding to the cooler. In the current study the measurement setup was completed by a heat-flux sensor array placed under the micro-cooler. This way we could compare the heat-transfer coefficient values obtained (1) from the identified thermal resistance value and (2) calculated directly from the measured heat-flux values. Good matching of the values obtained the different methods was found. ©2005 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=33847246436&partnerID=8YFLogxK

M3 - Conference contribution

SN - 0780395786

SN - 9780780395787

VL - 2

SP - 664

EP - 669

BT - Proceedings of 7th Electronics Packaging Technology Conference, EPTC 2005

T2 - 7th Electronics Packaging Technology Conference

Y2 - 7 December 2005 through 9 December 2005

ER -

Experimental study of a radial micro-channel cooling plate

Abstract

Conference

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