Experimental investigation of open-ended microwave oven assisted encapsulation process

S. K. Pavuluri; M. Ferenets; G. Goussetis; M. P Y Desmulliez; T. Tilford; R. Adamietz; G. Muller; F. Eicher; C. Bailey

doi:10.1109/ESTC.2010.5643015

Experimental investigation of open-ended microwave oven assisted encapsulation process

S. K. Pavuluri, M. Ferenets, G. Goussetis, M. P Y Desmulliez, T. Tilford, R. Adamietz, G. Muller, F. Eicher, C. Bailey

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

4 Citations (Scopus)

Abstract

An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~100% degree of cure.

Original language	English
Title of host publication	Electronics System Integration Technology Conference, ESTC 2010 - Proceedings
DOIs	https://doi.org/10.1109/ESTC.2010.5643015
Publication status	Published - 2010
Event	3rd Electronics System Integration Technology Conference - Berlin, Germany Duration: 13 Sept 2010 → 16 Sept 2010

Conference

Conference	3rd Electronics System Integration Technology Conference
Abbreviated title	ESTC 2010
Country/Territory	Germany
City	Berlin
Period	13/09/10 → 16/09/10

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10.1109/ESTC.2010.5643015

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@inproceedings{25fb32a11e0f470ba6a179e44b3d3139,

title = "Experimental investigation of open-ended microwave oven assisted encapsulation process",

abstract = "An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~100% degree of cure.",

author = "Pavuluri, {S. K.} and M. Ferenets and G. Goussetis and Desmulliez, {M. P Y} and T. Tilford and R. Adamietz and G. Muller and F. Eicher and C. Bailey",

year = "2010",

doi = "10.1109/ESTC.2010.5643015",

language = "English",

isbn = "9781424485536",

booktitle = "Electronics System Integration Technology Conference, ESTC 2010 - Proceedings",

note = "3rd Electronics System Integration Technology Conference, ESTC 2010 ; Conference date: 13-09-2010 Through 16-09-2010",

}

Pavuluri, SK, Ferenets, M, Goussetis, G , Desmulliez, MPY, Tilford, T, Adamietz, R, Muller, G, Eicher, F & Bailey, C 2010, Experimental investigation of open-ended microwave oven assisted encapsulation process. in Electronics System Integration Technology Conference, ESTC 2010 - Proceedings. 3rd Electronics System Integration Technology Conference, Berlin, Germany, 13/09/10. https://doi.org/10.1109/ESTC.2010.5643015

TY - GEN

T1 - Experimental investigation of open-ended microwave oven assisted encapsulation process

AU - Pavuluri, S. K.

AU - Ferenets, M.

AU - Goussetis, G.

AU - Desmulliez, M. P Y

AU - Tilford, T.

AU - Adamietz, R.

AU - Muller, G.

AU - Eicher, F.

AU - Bailey, C.

PY - 2010

Y1 - 2010

N2 - An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~100% degree of cure.

AB - An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~100% degree of cure.

U2 - 10.1109/ESTC.2010.5643015

DO - 10.1109/ESTC.2010.5643015

M3 - Conference contribution

SN - 9781424485536

BT - Electronics System Integration Technology Conference, ESTC 2010 - Proceedings

T2 - 3rd Electronics System Integration Technology Conference

Y2 - 13 September 2010 through 16 September 2010

ER -

Experimental investigation of open-ended microwave oven assisted encapsulation process

Abstract

Conference

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