Experimental investigation of open-ended microwave oven assisted encapsulation process

S. K. Pavuluri, M. Ferenets, G. Goussetis, M. P Y Desmulliez, T. Tilford, R. Adamietz, G. Muller, F. Eicher, C. Bailey

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Citations (Scopus)

Abstract

An open ended microwave oven is presented with improved uniform heating, heating rates and power conversion efficiency. This next generation oven produces more uniform EM fields in the evanescent region forming part of the heating area of the oven. These fields are vital for the rapid and uniform heating of various electromagnetically lossy materials. A fibre optic temperature sensor and an IR pyrometer are used to measure in situ and in real-time the temperature of the curing materials. An automatic computer controlled closed feedback loop measures the temperature in the curing material and drives the microwave components to obtain predetermined curing temperature cycles for efficient curing. Uniform curing of the lossy encapsulants is achieved with this oven with typical cure cycle of 270 seconds with a ramp rate of 1°C/s and a hold period of 2 minutes. Differential scanning calorimeter based measurement for the pulsed microwave based curing of the polymer dielectric indicates a ~100% degree of cure.

Original languageEnglish
Title of host publicationElectronics System Integration Technology Conference, ESTC 2010 - Proceedings
DOIs
Publication statusPublished - 2010
Event3rd Electronics System Integration Technology Conference - Berlin, Germany
Duration: 13 Sep 201016 Sep 2010

Conference

Conference3rd Electronics System Integration Technology Conference
Abbreviated titleESTC 2010
CountryGermany
CityBerlin
Period13/09/1016/09/10

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