Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging

Research output: Contribution to conferencePaper

Original languageEnglish
Pages44-53
Number of pages10
Publication statusPublished - Feb 2003
EventProc. International Seminar MEMSTAND - Barcelona, Spain
Duration: 1 Feb 2003 → …

Conference

ConferenceProc. International Seminar MEMSTAND
Abbreviated titleMEMSTAND
CountrySpain
CityBarcelona
Period1/02/03 → …

Cite this

Desmulliez, M. P. Y. (2003). Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging. 44-53. Paper presented at Proc. International Seminar MEMSTAND, Barcelona, Spain.
Desmulliez, Marc Phillipe Yves. / Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging. Paper presented at Proc. International Seminar MEMSTAND, Barcelona, Spain.10 p.
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title = "Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging",
author = "Desmulliez, {Marc Phillipe Yves}",
year = "2003",
month = "2",
language = "English",
pages = "44--53",
note = "Proc. International Seminar MEMSTAND, MEMSTAND ; Conference date: 01-02-2003",

}

Desmulliez, MPY 2003, 'Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging', Paper presented at Proc. International Seminar MEMSTAND, Barcelona, Spain, 1/02/03 pp. 44-53.

Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging. / Desmulliez, Marc Phillipe Yves.

2003. 44-53 Paper presented at Proc. International Seminar MEMSTAND, Barcelona, Spain.

Research output: Contribution to conferencePaper

TY - CONF

T1 - Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging

AU - Desmulliez, Marc Phillipe Yves

PY - 2003/2

Y1 - 2003/2

M3 - Paper

SP - 44

EP - 53

ER -

Desmulliez MPY. Evaluation of Integrated Design and Simulation Tools for Hybrid Device Packaging. 2003. Paper presented at Proc. International Seminar MEMSTAND, Barcelona, Spain.