Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals

Jake Sanwell; Hannah Turner; Daniel Morris; M. J. Daniel Esser

doi:10.1109/CLEO/Europe-EQEC52157.2021.9542084

Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals

Jake Sanwell, Hannah Turner, Daniel Morris, M. J. Daniel Esser

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

A standard method for cooling slab lasers is conduction cooling, where heatsinks are attached to the crystal surfaces with some thermal interface material (TIM) to ensure proper thermal contact. Indium foil is the standard TIM used for this purpose [1] , but with rapid advances in TIM technology in the electronics packaging sector, more options are becoming available [2].

Original language	English
Title of host publication	2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)
Publisher	IEEE
ISBN (Electronic)	9781665418768
DOIs	https://doi.org/10.1109/CLEO/Europe-EQEC52157.2021.9542084
Publication status	Published - 30 Sept 2021
Event	2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference - Munich, Germany Duration: 21 Jun 2021 → 25 Jun 2021

Conference

Conference	2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference
Abbreviated title	CLEO/Europe-EQEC 2021
Country/Territory	Germany
City	Munich
Period	21/06/21 → 25/06/21

ASJC Scopus subject areas

Electronic, Optical and Magnetic Materials
Atomic and Molecular Physics, and Optics

Access to Document

10.1109/CLEO/Europe-EQEC52157.2021.9542084

Cite this

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title = "Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals",

abstract = "A standard method for cooling slab lasers is conduction cooling, where heatsinks are attached to the crystal surfaces with some thermal interface material (TIM) to ensure proper thermal contact. Indium foil is the standard TIM used for this purpose [1] , but with rapid advances in TIM technology in the electronics packaging sector, more options are becoming available [2].",

author = "Jake Sanwell and Hannah Turner and Daniel Morris and Esser, {M. J. Daniel}",

note = "Publisher Copyright: {\textcopyright} 2021 IEEE.; 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, CLEO/Europe-EQEC 2021 ; Conference date: 21-06-2021 Through 25-06-2021",

year = "2021",

month = sep,

day = "30",

doi = "10.1109/CLEO/Europe-EQEC52157.2021.9542084",

language = "English",

booktitle = "2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)",

publisher = "IEEE",

address = "United States",

}

Sanwell, J, Turner, H, Morris, D & Esser, MJD 2021, Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals. in 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)., 9542084, IEEE, 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference, Munich, Bavaria, Germany, 21/06/21. https://doi.org/10.1109/CLEO/Europe-EQEC52157.2021.9542084

TY - GEN

T1 - Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals

AU - Sanwell, Jake

AU - Turner, Hannah

AU - Morris, Daniel

AU - Esser, M. J. Daniel

PY - 2021/9/30

Y1 - 2021/9/30

N2 - A standard method for cooling slab lasers is conduction cooling, where heatsinks are attached to the crystal surfaces with some thermal interface material (TIM) to ensure proper thermal contact. Indium foil is the standard TIM used for this purpose [1] , but with rapid advances in TIM technology in the electronics packaging sector, more options are becoming available [2].

AB - A standard method for cooling slab lasers is conduction cooling, where heatsinks are attached to the crystal surfaces with some thermal interface material (TIM) to ensure proper thermal contact. Indium foil is the standard TIM used for this purpose [1] , but with rapid advances in TIM technology in the electronics packaging sector, more options are becoming available [2].

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U2 - 10.1109/CLEO/Europe-EQEC52157.2021.9542084

DO - 10.1109/CLEO/Europe-EQEC52157.2021.9542084

M3 - Conference contribution

AN - SCOPUS:85117612078

BT - 2021 Conference on Lasers and Electro-Optics Europe & European Quantum Electronics Conference (CLEO/Europe-EQEC)

PB - IEEE

T2 - 2021 Conference on Lasers and Electro-Optics Europe and European Quantum Electronics Conference

Y2 - 21 June 2021 through 25 June 2021

ER -

Evaluating Thermal Interface Materials for Mounting Slab Laser Crystals

Abstract

Conference

ASJC Scopus subject areas

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