Erratum: "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies)

Robert W. Kay, Stoyan Stoyanov, Greg P. Glinski, Chris Bailey, M. P Y Desmulliez

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)359-
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number2
DOIs
Publication statusPublished - Jun 2007

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