Erratum: "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies)

Robert W. Kay; Stoyan Stoyanov; Greg P. Glinski; Chris Bailey; M. P Y Desmulliez

doi:10.1109/TCAPT.2007.895649

Erratum: "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies)

Robert W. Kay, Stoyan Stoyanov, Greg P. Glinski, Chris Bailey, M. P Y Desmulliez

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

Original language	English
Pages (from-to)	359-
Journal	IEEE Transactions on Components and Packaging Technologies
Volume	30
Issue number	2
DOIs	https://doi.org/10.1109/TCAPT.2007.895649
Publication status	Published - Jun 2007

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10.1109/TCAPT.2007.895649

Cite this

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title = "Erratum: {"}Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process{"} (IEEE Transactions on Components and Packaging Technologies)",

author = "Kay, {Robert W.} and Stoyan Stoyanov and Glinski, {Greg P.} and Chris Bailey and Desmulliez, {M. P Y}",

year = "2007",

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Erratum : "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies). / Kay, Robert W.; Stoyanov, Stoyan; Glinski, Greg P. et al.

In: IEEE Transactions on Components and Packaging Technologies, Vol. 30, No. 2, 06.2007, p. 359-.

Research output: Contribution to journal › Article › peer-review

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T2 - "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies)

AU - Kay, Robert W.

AU - Stoyanov, Stoyan

AU - Glinski, Greg P.

AU - Bailey, Chris

AU - Desmulliez, M. P Y

PY - 2007/6

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U2 - 10.1109/TCAPT.2007.895649

DO - 10.1109/TCAPT.2007.895649

M3 - Article

SN - 1521-3331

VL - 30

SP - 359-

JO - IEEE Transactions on Components and Packaging Technologies

JF - IEEE Transactions on Components and Packaging Technologies

IS - 2

ER -

Erratum: "Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process" (IEEE Transactions on Components and Packaging Technologies)

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