Enhancing fatigue performance of damaged metallic structures by bonded CFRP patches considering temperature effects

Lu Ke, Chuanxi Li, Jun He, Qiang Shen, Yongming Liu, Yang Jiao

Research output: Contribution to journalArticle

1 Citation (Scopus)
4 Downloads (Pure)

Abstract

This paper reports an experimental and theoretical investigation on the fatigue performance enhancement of damaged steel structures by bonded carbon fiber reinforced polymer (CFRP) systems considering the temperature effects. First, thermomechanical properties of the epoxy adhesive and CFRPs were examined via dynamic mechanical analysis (DMA) and tensile tests. The appropriate curing procedure for the structural adhesive was obtained. Next, the fatigue behavior of notched steel plates strengthened by bonded CFRPs was investigated at different temperatures. During the fatigue tests, beach marking and back-face strain techniques were used to monitor the fatigue crack growth on steel components and the damage evolution within the bonding interface. The results show that the high-temperature resistance of the epoxy adhesive can be effectively improved by increasing the curing temperature and duration. The properly cured bonded CFRP patches can effectively enhance the fatigue performance of damaged steel structures. However, and the elevated temperatures significantly degrade the fatigue behavior of the CFRP-strengthened steel components.
Original languageEnglish
Article number108731
JournalMaterials & Design
Volume192
Early online date15 Apr 2020
DOIs
Publication statusPublished - Jul 2020

Keywords

  • Carbon fiber reinforced polymer (CFRP)
  • Elevated temperature
  • Epoxy adhesive
  • Fatigue
  • Metallic structure
  • Reinforcement

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Fingerprint Dive into the research topics of 'Enhancing fatigue performance of damaged metallic structures by bonded CFRP patches considering temperature effects'. Together they form a unique fingerprint.

Cite this