Encapsulation of microelectronic components using open-ended microwave oven

Sumanth Kumar Pavuluri*, Marju Ferenets, George Goussetis, Marc P. Y. Desmulliez, Tim Tilford, Raphael Adamietz, Guido Muller, Frank Eicher, Chris Bailey

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

12 Citations (Scopus)


An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

Original languageEnglish
Pages (from-to)799-806
Number of pages8
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
Issue number5
Publication statusPublished - May 2012


  • ceramics
  • packaging
  • thermal runaway
  • electromagnetic heating
  • encapsulation


Dive into the research topics of 'Encapsulation of microelectronic components using open-ended microwave oven'. Together they form a unique fingerprint.

Cite this