Encapsulation of microelectronic components using open-ended microwave oven

Sumanth Kumar Pavuluri; Marju Ferenets; George Goussetis; Marc P. Y. Desmulliez; Tim Tilford; Raphael Adamietz; Guido Muller; Frank Eicher; Chris Bailey

doi:10.1109/TCPMT.2011.2177524

Encapsulation of microelectronic components using open-ended microwave oven

Sumanth Kumar Pavuluri^*, Marju Ferenets, George Goussetis, Marc P. Y. Desmulliez, Tim Tilford, Raphael Adamietz, Guido Muller, Frank Eicher, Chris Bailey

^*Corresponding author for this work

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Abstract

An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

Original language	English
Pages (from-to)	799-806
Number of pages	8
Journal	IEEE Transactions on Components, Packaging and Manufacturing Technology
Volume	2
Issue number	5
DOIs	https://doi.org/10.1109/TCPMT.2011.2177524
Publication status	Published - May 2012

Keywords

ceramics
packaging
thermal runaway
electromagnetic heating
encapsulation

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10.1109/TCPMT.2011.2177524

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title = "Encapsulation of microelectronic components using open-ended microwave oven",

abstract = "An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.",

keywords = "ceramics, packaging, thermal runaway, electromagnetic heating, encapsulation",

author = "Pavuluri, {Sumanth Kumar} and Marju Ferenets and George Goussetis and Desmulliez, {Marc P. Y.} and Tim Tilford and Raphael Adamietz and Guido Muller and Frank Eicher and Chris Bailey",

note = "INSPEC Accession Number: 12696706",

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AU - Pavuluri, Sumanth Kumar

AU - Ferenets, Marju

AU - Goussetis, George

AU - Desmulliez, Marc P. Y.

AU - Tilford, Tim

AU - Adamietz, Raphael

AU - Muller, Guido

AU - Eicher, Frank

AU - Bailey, Chris

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N2 - An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

AB - An open-ended microwave oven system is presented and characterized for the rapid encapsulation of microelectronic components. In situ real-time measurement of the temperature of the curing materials is carried out by an infrared pyrometer integrated in the microwave head of the oven. An automatic computer-controlled closed feedback loop has been used to measure the temperature in the curing material and modulate the system operating power to obtain predefined curing temperature cycles for efficient curing. Uniform curing of the encapsulant material is achieved with typical cure time of similar to 300 s with a ramp rate of 1.66 degrees C/s and a hold period of similar to 100 s. Differential scanning calorimeter based measurement for the curing of the polymer dielectric indicates a near 100% degree of cure.

KW - ceramics

KW - packaging

KW - thermal runaway

KW - electromagnetic heating

KW - encapsulation

U2 - 10.1109/TCPMT.2011.2177524

DO - 10.1109/TCPMT.2011.2177524

M3 - Article

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JO - IEEE Transactions on Components, Packaging and Manufacturing Technology

JF - IEEE Transactions on Components, Packaging and Manufacturing Technology

IS - 5

ER -

Encapsulation of microelectronic components using open-ended microwave oven

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Keywords

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