Encapsulation method

Changhai Wang; Jun Zeng

Encapsulation method

Changhai Wang (Inventor)
, Jun Zeng (Inventor)

Research output: Patent

Original language	English
Patent number	GB 2476209B
IPC	B81B7/00; B81C1/00
Priority date	19/09/08
Publication status	Published - 25 Mar 2010

Keywords

3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS

Cite this

@misc{70eee9cbd5954f239c22de4abfb52963,

title = "Encapsulation method",

keywords = "3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS ",

author = "Changhai Wang and Jun Zeng",

note = "From the European Patent Register: {"}Status - The application is deemed to be withdrawn. Database last updated on 07.07.2015{"} ; GB 2476209B; B81B7/00; B81C1/00",

year = "2010",

month = mar,

day = "25",

language = "English",

type = "Patent",

}