Encapsulation method

Changhai Wang (Inventor), Jun Zeng (Inventor)

Research output: Patent

Original languageEnglish
Patent numberGB 2476209B
IPCB81B7/00; B81C1/00
Priority date19/09/08
Publication statusPublished - 25 Mar 2010

Keywords

  • 3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS

Cite this

Wang, C., & Zeng, J. (2010). IPC No. B81B7/00; B81C1/00. Encapsulation method. (Patent No. GB 2476209B).
Wang, Changhai (Inventor) ; Zeng, Jun (Inventor). / Encapsulation method. IPC No.: B81B7/00; B81C1/00. Patent No.: GB 2476209B.
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title = "Encapsulation method",
keywords = "3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS",
author = "Changhai Wang and Jun Zeng",
note = "From the European Patent Register: {"}Status - The application is deemed to be withdrawn. Database last updated on 07.07.2015{"} ; GB 2476209B; B81B7/00; B81C1/00",
year = "2010",
month = "3",
day = "25",
language = "English",
type = "Patent",

}

Wang, C & Zeng, J 2010, Encapsulation method, Patent No. GB 2476209B, IPC No. B81B7/00; B81C1/00.

Encapsulation method. / Wang, Changhai (Inventor); Zeng, Jun (Inventor).

IPC No.: B81B7/00; B81C1/00. Patent No.: GB 2476209B.

Research output: Patent

TY - PAT

T1 - Encapsulation method

AU - Wang, Changhai

AU - Zeng, Jun

N1 - From the European Patent Register: "Status - The application is deemed to be withdrawn. Database last updated on 07.07.2015"

PY - 2010/3/25

Y1 - 2010/3/25

KW - 3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS

M3 - Patent

M1 - GB 2476209B

ER -

Wang C, Zeng J, inventors. Encapsulation method. B81B7/00; B81C1/00. 2010 Mar 25.