Encapsulation method

Changhai Wang (Inventor), Jun Zeng (Inventor)

Research output: Patent

Original languageEnglish
Patent numberGB 2476209B
IPCB81B7/00; B81C1/00
Priority date19/09/08
Publication statusPublished - 25 Mar 2010

Keywords

  • 3D wafer level packaing, embedded moisture barriers, vertical interconnects, MEMS

Cite this

Wang, C., & Zeng, J. (2010). IPC No. B81B7/00; B81C1/00. Encapsulation method. (Patent No. GB 2476209B).