Electroplating for high aspect ratio vias in PCB manufacturing: Enhancement capabilities of acoustic streaming

Nadezhda Strusevich, Marc P Y Desmulliez, Eitan Abraham, David Flynn, Tom Jones, Mayur Patel, Christopher Bailey

Research output: Contribution to journalArticle

7 Citations (Scopus)

Abstract

This paper considers the copper electrodeposition processes in microvias and investigates whether the quality of the electroplating process can be improved by acoustic streaming using megasonic transducers placed into a plating cell. The theoretical results show that acoustic streaming does not take place within the micro-via (either through or blind-via's), however it does help improve cupric ion transport in the area close to the mouth of a via. This replenishment of cupric ions at the mouth of micro-via leads to better quality filling of the micro-via through diffusion compared to basic conditions. Experiments showing the improved quality of the filling of vias are also presented.

Original languageEnglish
Pages (from-to)211-217
Number of pages7
JournalAdvances in Manufacturing
Volume1
Issue number3
DOIs
Publication statusPublished - 1 Jan 2013

Keywords

  • Acoustic streaming
  • Electronics manufacturing
  • Electroplating
  • High aspect ratio microvia
  • Megasonic agitation
  • Numerical modelling

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering
  • Mechanical Engineering
  • Mechanics of Materials
  • Polymers and Plastics

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