Electrodeposition of Sn-Cu solder alloy for electronics interconnection

  • Yi Qin
  • , Abdul Wassay
  • , Changqing Liu
  • , G. D. Wilcox
  • , Kun Zhao
  • , Changhai Wang

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

14 Citations (Scopus)

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Material Science

Engineering