Abstract
Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of ß-Sn and Cu 6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. ©2009 IEEE.
Original language | English |
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Title of host publication | 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 |
Pages | 772-777 |
Number of pages | 6 |
DOIs | |
Publication status | Published - 2009 |
Event | 2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009 |
Conference
Conference | 2009 International Conference on Electronic Packaging Technology and High Density Packaging |
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Abbreviated title | ICEPT-HDP 2009 |
Country | China |
City | Beijing |
Period | 10/08/09 → 13/08/09 |