Electrodeposition of Sn-Cu solder alloy for electronics interconnection

Yi Qin, Abdul Wassay, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

10 Citations (Scopus)

Abstract

Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of ß-Sn and Cu 6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. ©2009 IEEE.

Original languageEnglish
Title of host publication2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages772-777
Number of pages6
DOIs
Publication statusPublished - 2009
Event2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China
Duration: 10 Aug 200913 Aug 2009

Conference

Conference2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated titleICEPT-HDP 2009
CountryChina
CityBeijing
Period10/08/0913/08/09

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    Qin, Y., Wassay, A., Liu, C., Wilcox, G. D., Zhao, K., & Wang, C. (2009). Electrodeposition of Sn-Cu solder alloy for electronics interconnection. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 772-777) https://doi.org/10.1109/ICEPT.2009.5270643