Electrodeposition of Sn-Cu solder alloy for electronics interconnection

Yi Qin; Abdul Wassay; Changqing Liu; G. D. Wilcox; Kun Zhao; Changhai Wang

doi:10.1109/ICEPT.2009.5270643

Electrodeposition of Sn-Cu solder alloy for electronics interconnection

Yi Qin, Abdul Wassay, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

10 Citations (Scopus)

Abstract

Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of ß-Sn and Cu ₆Sn₅ was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. ©2009 IEEE.

Original language	English
Title of host publication	2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009
Pages	772-777
Number of pages	6
DOIs	https://doi.org/10.1109/ICEPT.2009.5270643
Publication status	Published - 2009
Event	2009 International Conference on Electronic Packaging Technology and High Density Packaging - Beijing, China Duration: 10 Aug 2009 → 13 Aug 2009

Conference

Conference	2009 International Conference on Electronic Packaging Technology and High Density Packaging
Abbreviated title	ICEPT-HDP 2009
Country	China
City	Beijing
Period	10/08/09 → 13/08/09

Access to Document

10.1109/ICEPT.2009.5270643

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Qin, Y., Wassay, A., Liu, C., Wilcox, G. D., Zhao, K., & Wang, C. (2009). Electrodeposition of Sn-Cu solder alloy for electronics interconnection. In 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 (pp. 772-777) https://doi.org/10.1109/ICEPT.2009.5270643

@inproceedings{ed36b07d7d004255aad90188c64f6c59,

title = "Electrodeposition of Sn-Cu solder alloy for electronics interconnection",

abstract = "Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of {\ss}-Sn and Cu 6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. {\textcopyright}2009 IEEE.",

author = "Yi Qin and Abdul Wassay and Changqing Liu and Wilcox, {G. D.} and Kun Zhao and Changhai Wang",

year = "2009",

doi = "10.1109/ICEPT.2009.5270643",

language = "English",

isbn = "9781424446599",

pages = "772--777",

booktitle = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009",

note = "2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009 ; Conference date: 10-08-2009 Through 13-08-2009",

}

Qin, Y, Wassay, A, Liu, C, Wilcox, GD, Zhao, K & Wang, C 2009, Electrodeposition of Sn-Cu solder alloy for electronics interconnection. in 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. pp. 772-777, 2009 International Conference on Electronic Packaging Technology and High Density Packaging, Beijing, China, 10/08/09. https://doi.org/10.1109/ICEPT.2009.5270643

Electrodeposition of Sn-Cu solder alloy for electronics interconnection. / Qin, Yi; Wassay, Abdul; Liu, Changqing; Wilcox, G. D.; Zhao, Kun; Wang, Changhai.

2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009. 2009. p. 772-777.

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

TY - GEN

T1 - Electrodeposition of Sn-Cu solder alloy for electronics interconnection

AU - Qin, Yi

AU - Wassay, Abdul

AU - Liu, Changqing

AU - Wilcox, G. D.

AU - Zhao, Kun

AU - Wang, Changhai

PY - 2009

Y1 - 2009

N2 - Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of ß-Sn and Cu 6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. ©2009 IEEE.

AB - Eutectic Sn-Cu alloy is one of the lead-free solder candidates for electronics interconnection. The methanesulphonic acid based baths were investigated for the electrodeposition of Sn-Cu alloys. The effect of iso-octyl phenoxy polyethoxy ethanol (Triton X-100) as a surfactant was studied, its addition proved to facilitate achieving the near eutectic composition of Sn-Cu alloy with improved microstructure. Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) results indicated that a biphasic structure of ß-Sn and Cu 6Sn5 was present in the as-electroplated film. Fine pitch near eutectic Sn-Cu solder bumps were also produced on a test wafer. ©2009 IEEE.

U2 - 10.1109/ICEPT.2009.5270643

DO - 10.1109/ICEPT.2009.5270643

M3 - Conference contribution

SN - 9781424446599

SP - 772

EP - 777

BT - 2009 International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2009

T2 - 2009 International Conference on Electronic Packaging Technology and High Density Packaging

Y2 - 10 August 2009 through 13 August 2009

ER -