Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Yi Qin, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Fingerprint Dive into the research topics of 'Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection'. Together they form a unique fingerprint.

Physics & Astronomy