Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

INIS

• alloys 100%
• eutectics 100%
• films 100%
• iodides 100%
• electrodeposition 100%
• pyrophosphates 100%
• scanning electron microscopy 50%
• data 50%
• x-ray diffraction 50%
• glass 50%
• wavelengths 50%
• spectroscopy 50%
• morphology 50%
• chelating agents 50%
• pitches 50%

Material Science

• Electrodeposition 100%
• Film 100%
• Scanning Electron Microscopy 50%
• Lead-Free Solder 50%
• Copper Alloys 50%
• X-Ray Diffraction 50%

Engineering

• Eutectics 100%
• Ray Diffraction 50%
• Deposited Film 50%
• Solder Bump 50%
• Free Solder 50%