Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Yi Qin, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Citations (Scopus)

Abstract

A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive Xray Spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag 3Sn and Cu6Sn5 were present in the "as-electroplated" film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer. ©2009 IEEE.

Original languageEnglish
Title of host publicationEPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages278-282
Number of pages5
DOIs
Publication statusPublished - 2009
Event2009 11th Electronic Packaging Technology Conference - Singapore, Singapore
Duration: 9 Dec 200911 Dec 2009

Conference

Conference2009 11th Electronic Packaging Technology Conference
Abbreviated titleEPTC 2009
CountrySingapore
CitySingapore
Period9/12/0911/12/09

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