Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Yi Qin; Changqing Liu; G. D. Wilcox; Kun Zhao; Changhai Wang

doi:10.1109/EPTC.2009.5416536

Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

Yi Qin, Changqing Liu, G. D. Wilcox, Kun Zhao, Changhai Wang

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

3 Citations (Scopus)

Abstract

A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive Xray Spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag ₃Sn and Cu₆Sn₅ were present in the "as-electroplated" film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer. ©2009 IEEE.

Original language	English
Title of host publication	EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference
Pages	278-282
Number of pages	5
DOIs	https://doi.org/10.1109/EPTC.2009.5416536
Publication status	Published - 2009
Event	2009 11th Electronic Packaging Technology Conference - Singapore, Singapore Duration: 9 Dec 2009 → 11 Dec 2009

Conference

Conference	2009 11th Electronic Packaging Technology Conference
Abbreviated title	EPTC 2009
Country/Territory	Singapore
City	Singapore
Period	9/12/09 → 11/12/09

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10.1109/EPTC.2009.5416536

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@inproceedings{6b598289565946b4ab2476dbe6d2bb6c,

title = "Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection",

abstract = "A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive Xray Spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag 3Sn and Cu6Sn5 were present in the {"}as-electroplated{"} film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer. {\textcopyright}2009 IEEE.",

author = "Yi Qin and Changqing Liu and Wilcox, {G. D.} and Kun Zhao and Changhai Wang",

year = "2009",

doi = "10.1109/EPTC.2009.5416536",

language = "English",

isbn = "9781424451005",

pages = "278--282",

booktitle = "EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference",

note = "2009 11th Electronic Packaging Technology Conference, EPTC 2009 ; Conference date: 09-12-2009 Through 11-12-2009",

}

TY - GEN

T1 - Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

AU - Qin, Yi

AU - Liu, Changqing

AU - Wilcox, G. D.

AU - Zhao, Kun

AU - Wang, Changhai

PY - 2009

Y1 - 2009

N2 - A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive Xray Spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag 3Sn and Cu6Sn5 were present in the "as-electroplated" film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer. ©2009 IEEE.

AB - A pyrophosphate and iodide based bath was investigated for the electrodeposition of near-eutectic Sn-Ag-Cu alloy, which is one of the promising lead-free solder candidates for electronics interconnection. The bath contained pyrophosphate and iodide as chelating agents. The composition of electrodeposits were measured by wavelength dispersive Xray Spectroscopy (WDS). Different morphologies of deposited films were analysed using scanning electron microscopy (SEM). X-ray diffraction (XRD) data indicated that Sn, Ag 3Sn and Cu6Sn5 were present in the "as-electroplated" film. The proposed bath was capable of fine pitch near-eutectic Sn-Ag-Cu solder bumps as demonstrated on a glass test wafer. ©2009 IEEE.

UR - http://www.scopus.com/inward/record.url?scp=77950918793&partnerID=8YFLogxK

U2 - 10.1109/EPTC.2009.5416536

DO - 10.1109/EPTC.2009.5416536

M3 - Conference contribution

SN - 9781424451005

SP - 278

EP - 282

BT - EPTC 2009 - Proceedings of 2009 11th Electronic Packaging Technology Conference

T2 - 2009 11th Electronic Packaging Technology Conference

Y2 - 9 December 2009 through 11 December 2009

ER -

Electrodeposition of Sn-Ag-Cu solder alloy for electronics interconnection

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