Abstract
In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.
| Original language | English |
|---|---|
| Title of host publication | MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop |
| Subtitle of host publication | 19-22 June 2011 Tønsberg, Norway |
| Place of Publication | Tønsberg |
| Publisher | Vestfold University College |
| Pages | 266-269 |
| Number of pages | 4 |
| ISBN (Print) | 9788278602249 |
| Publication status | Published - 2011 |
| Event | The 22nd Micromechanics and Microsystems Technology Europe Workshop - Vestfold University College, Tønsberg, Norway Duration: 10 Mar 2011 → 11 Mar 2011 |
Conference
| Conference | The 22nd Micromechanics and Microsystems Technology Europe Workshop |
|---|---|
| Abbreviated title | MME 2011 |
| Country | Norway |
| City | Tønsberg |
| Period | 10/03/11 → 11/03/11 |
Keywords
- Electrodeposition
- acoustic agitation
- Electroplating
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Cite this
Flynn, D., Desmulliez, M. P. Y., Bailey, C., Patel, M. K., & Kay, R. W. (2011). Electrodeposition of Copper into PCB vias under megasonic agitation. In MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop: 19-22 June 2011 Tønsberg, Norway (pp. 266-269). Vestfold University College.