Electrodeposition of Copper into PCB vias under megasonic agitation

David Flynn; Marc Phillipe Yves Desmulliez; Christopher Bailey; Mayur K. Patel; Robert W Kay

Electrodeposition of Copper into PCB vias under megasonic agitation

David Flynn, Marc Phillipe Yves Desmulliez, Christopher Bailey, Mayur K. Patel, Robert W Kay

Research output: Chapter in Book/Report/Conference proceeding › Chapter (peer-reviewed) › peer-review

Abstract

In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.

Original language	English
Title of host publication	MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop
Subtitle of host publication	19-22 June 2011 Tønsberg, Norway
Place of Publication	Tønsberg
Publisher	Vestfold University College
Pages	266-269
Number of pages	4
ISBN (Print)	9788278602249
Publication status	Published - 2011
Event	The 22nd Micromechanics and Microsystems Technology Europe Workshop - Vestfold University College, Tønsberg, Norway Duration: 10 Mar 2011 → 11 Mar 2011

Conference

Conference	The 22nd Micromechanics and Microsystems Technology Europe Workshop
Abbreviated title	MME 2011
Country	Norway
City	Tønsberg
Period	10/03/11 → 11/03/11

Keywords

Electrodeposition
acoustic agitation
Electroplating

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title = "Electrodeposition of Copper into PCB vias under megasonic agitation",

abstract = "In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.",

keywords = "Electrodeposition, acoustic agitation, Electroplating",

author = "David Flynn and Desmulliez, {Marc Phillipe Yves} and Christopher Bailey and Patel, {Mayur K.} and Kay, {Robert W}",

year = "2011",

language = "English",

isbn = "9788278602249",

pages = "266--269",

booktitle = "MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop",

publisher = "Vestfold University College",

note = "The 22nd Micromechanics and Microsystems Technology Europe Workshop, MME 2011 ; Conference date: 10-03-2011 Through 11-03-2011",

}

Flynn, D , Desmulliez, MPY, Bailey, C, Patel, MK & Kay, RW 2011, Electrodeposition of Copper into PCB vias under megasonic agitation. in MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop: 19-22 June 2011 Tønsberg, Norway. Vestfold University College, Tønsberg, pp. 266-269, The 22nd Micromechanics and Microsystems Technology Europe Workshop, Tønsberg, Norway, 10/03/11.

Electrodeposition of Copper into PCB vias under megasonic agitation. / Flynn, David ; Desmulliez, Marc Phillipe Yves; Bailey, Christopher; Patel, Mayur K.; Kay, Robert W.

MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop: 19-22 June 2011 Tønsberg, Norway. Tønsberg : Vestfold University College, 2011. p. 266-269.

Research output: Chapter in Book/Report/Conference proceeding › Chapter (peer-reviewed) › peer-review

TY - CHAP

T1 - Electrodeposition of Copper into PCB vias under megasonic agitation

AU - Flynn, David

AU - Desmulliez, Marc Phillipe Yves

AU - Bailey, Christopher

AU - Patel, Mayur K.

AU - Kay, Robert W

PY - 2011

Y1 - 2011

N2 - In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.

AB - In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.

KW - Electrodeposition

KW - acoustic agitation

KW - Electroplating

M3 - Chapter (peer-reviewed)

SN - 9788278602249

SP - 266

EP - 269

BT - MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop

PB - Vestfold University College

CY - Tønsberg

T2 - The 22nd Micromechanics and Microsystems Technology Europe Workshop

Y2 - 10 March 2011 through 11 March 2011

ER -