Electrodeposition of Copper into PCB vias under megasonic agitation

David Flynn, Marc Phillipe Yves Desmulliez, Christopher Bailey, Mayur K. Patel, Robert W Kay

Research output: Chapter in Book/Report/Conference proceedingChapter (peer-reviewed)

Abstract

In this paper we present progresses made into understanding the improvement of the quality of electroplated copper PCB vias submitted to megasonic agitation. Depleted ion concentration in high aspect ratio vias leads to voids and incomplete deposition of copper in PCB vias and through silicon vias. This paper presents the improved quality of electrodeposited copper in microvias with height-to-width aspect ratio (AR) of up to 8:1.
Original languageEnglish
Title of host publicationMME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop
Subtitle of host publication19-22 June 2011 Tønsberg, Norway
Place of PublicationTønsberg
PublisherVestfold University College
Pages266-269
Number of pages4
ISBN (Print)9788278602249
Publication statusPublished - 2011
EventThe 22nd Micromechanics and Microsystems Technology Europe Workshop - Vestfold University College, Tønsberg, Norway
Duration: 10 Mar 201111 Mar 2011

Conference

ConferenceThe 22nd Micromechanics and Microsystems Technology Europe Workshop
Abbreviated titleMME 2011
CountryNorway
CityTønsberg
Period10/03/1111/03/11

Keywords

  • Electrodeposition
  • acoustic agitation
  • Electroplating

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  • Cite this

    Flynn, D., Desmulliez, M. P. Y., Bailey, C., Patel, M. K., & Kay, R. W. (2011). Electrodeposition of Copper into PCB vias under megasonic agitation. In MME 2011: Proceedings of the 22nd Micromechanics and Microsystems Technology Europe Workshop: 19-22 June 2011 Tønsberg, Norway (pp. 266-269). Vestfold University College.