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Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation
S. Costello*, N. Strusevich, D. Flynn, R. W. Kay, Mayur K. Patel, Chris Bailey, Dennis Price, Mathieu Bennet, Anthony C. Jones, M. P Y Desmulliez
*Corresponding author for this work
Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
1
Citation
(Scopus)