Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

S. Costello*, N. Strusevich, D. Flynn, R. W. Kay, Mayur K. Patel, Chris Bailey, Dennis Price, Mathieu Bennet, Anthony C. Jones, M. P Y Desmulliez

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Fingerprint

Dive into the research topics of 'Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation'. Together they form a unique fingerprint.

INIS

Chemical Engineering