Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

S. Costello; N. Strusevich; D. Flynn; R. W. Kay; Mayur K. Patel; Chris Bailey; Dennis Price; Mathieu Bennet; Anthony C. Jones; M. P Y Desmulliez

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

S. Costello^*, N. Strusevich, D. Flynn, R. W. Kay, Mayur K. Patel, Chris Bailey, Dennis Price, Mathieu Bennet, Anthony C. Jones, M. P Y Desmulliez

^*Corresponding author for this work

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

2 Citations (Scopus)

Abstract

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

Original language	English
Title of host publication	DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Place of Publication	Piscataway (New Jersey)
Publisher	IEEE
Pages	98-102
Number of pages	5
ISBN (Print)	9781467307857
Publication status	Published - 2012
Event	2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes Cote d'Azur, France Duration: 25 Apr 2012 → 27 Apr 2012

Conference

Conference	2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated title	DTIP 2012
Country/Territory	France
City	Cannes Cote d'Azur
Period	25/04/12 → 27/04/12

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

@inproceedings{398510b2928f4107a684ab20e84e51dc,

title = "Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation",

abstract = "This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.",

author = "S. Costello and N. Strusevich and D. Flynn and Kay, \{R. W.\} and Patel, \{Mayur K.\} and Chris Bailey and Dennis Price and Mathieu Bennet and Jones, \{Anthony C.\} and Desmulliez, \{M. P Y\}",

year = "2012",

language = "English",

isbn = "9781467307857",

pages = "98--102",

booktitle = "DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS",

publisher = "IEEE",

address = "United States",

note = "2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, DTIP 2012 ; Conference date: 25-04-2012 Through 27-04-2012",

}

Costello, S, Strusevich, N, Flynn, D, Kay, RW, Patel, MK, Bailey, C, Price, D, Bennet, M, Jones, AC & Desmulliez, MPY 2012, Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. in DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 6235340, IEEE, Piscataway (New Jersey), pp. 98-102, 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes Cote d'Azur, France, 25/04/12.

TY - GEN

T1 - Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

AU - Costello, S.

AU - Strusevich, N.

AU - Flynn, D.

AU - Kay, R. W.

AU - Patel, Mayur K.

AU - Bailey, Chris

AU - Price, Dennis

AU - Bennet, Mathieu

AU - Jones, Anthony C.

AU - Desmulliez, M. P Y

PY - 2012

Y1 - 2012

N2 - This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

AB - This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

UR - https://www.scopus.com/pages/publications/84864659179

M3 - Conference contribution

AN - SCOPUS:84864659179

SN - 9781467307857

SP - 98

EP - 102

BT - DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

PB - IEEE

CY - Piscataway (New Jersey)

T2 - 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS

Y2 - 25 April 2012 through 27 April 2012

ER -

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Abstract

Conference

ASJC Scopus subject areas

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