Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

S. Costello, N. Strusevich, D. Flynn, R. W. Kay, Mayur K. Patel, Chris Bailey, Dennis Price, Mathieu Bennet, Anthony C. Jones, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

Original languageEnglish
Title of host publicationDTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Place of PublicationPiscataway (New Jersey)
PublisherIEEE
Pages98-102
Number of pages5
ISBN (Print)9781467307857
Publication statusPublished - 2012
Event2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes Cote d'Azur, France
Duration: 25 Apr 201227 Apr 2012

Conference

Conference2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated titleDTIP 2012
CountryFrance
CityCannes Cote d'Azur
Period25/04/1227/04/12

Fingerprint

Polychlorinated biphenyls
Electrodeposition
Aspect ratio
Copper
Ions
Electroplating
Velocity measurement
Flow of fluids
Imaging techniques

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

Cite this

Costello, S., Strusevich, N., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., ... Desmulliez, M. P. Y. (2012). Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 98-102). [6235340] Piscataway (New Jersey): IEEE.
Costello, S. ; Strusevich, N. ; Flynn, D. ; Kay, R. W. ; Patel, Mayur K. ; Bailey, Chris ; Price, Dennis ; Bennet, Mathieu ; Jones, Anthony C. ; Desmulliez, M. P Y. / Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Piscataway (New Jersey) : IEEE, 2012. pp. 98-102
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abstract = "This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.",
author = "S. Costello and N. Strusevich and D. Flynn and Kay, {R. W.} and Patel, {Mayur K.} and Chris Bailey and Dennis Price and Mathieu Bennet and Jones, {Anthony C.} and Desmulliez, {M. P Y}",
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Costello, S, Strusevich, N, Flynn, D, Kay, RW, Patel, MK, Bailey, C, Price, D, Bennet, M, Jones, AC & Desmulliez, MPY 2012, Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. in DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS., 6235340, IEEE, Piscataway (New Jersey), pp. 98-102, 2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS, Cannes Cote d'Azur, France, 25/04/12.

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. / Costello, S.; Strusevich, N.; Flynn, D.; Kay, R. W.; Patel, Mayur K.; Bailey, Chris; Price, Dennis; Bennet, Mathieu; Jones, Anthony C.; Desmulliez, M. P Y.

DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Piscataway (New Jersey) : IEEE, 2012. p. 98-102 6235340.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

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AB - This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

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Costello S, Strusevich N, Flynn D, Kay RW, Patel MK, Bailey C et al. Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS. Piscataway (New Jersey): IEEE. 2012. p. 98-102. 6235340