Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

S. Costello, N. Strusevich, D. Flynn, R. W. Kay, Mayur K. Patel, Chris Bailey, Dennis Price, Mathieu Bennet, Anthony C. Jones, M. P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper presents the use of micro-particle imaging velocimetry (micro-PIV) to analyse fluid flow and hence ion replenishment in PCB micro-via during the electroplating process. Megasonic streaming is used to remove bubbles from blind micro-via and promote ion transportation within high aspect ratio PCB micro-via to enhance electrodeposition.

Original languageEnglish
Title of host publicationDTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Place of PublicationPiscataway (New Jersey)
PublisherIEEE
Pages98-102
Number of pages5
ISBN (Print)9781467307857
Publication statusPublished - 2012
Event2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - Cannes Cote d'Azur, France
Duration: 25 Apr 201227 Apr 2012

Conference

Conference2012 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS
Abbreviated titleDTIP 2012
CountryFrance
CityCannes Cote d'Azur
Period25/04/1227/04/12

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Costello, S., Strusevich, N., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., Price, D., Bennet, M., Jones, A. C., & Desmulliez, M. P. Y. (2012). Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. In DTIP 2012 - Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (pp. 98-102). [6235340] IEEE.