Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Suzanne Costello; N. Strusevich; David Flynn; Robert W Kay; M. K. Patel; Chris Bailey; D. Price; M. Bennet; A C Jones; Marc Phillipe Yves Desmulliez

doi:10.1007/s00542-013-1746-7

Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Suzanne Costello, N. Strusevich, David Flynn, Robert W Kay, M. K. Patel, Chris Bailey, D. Price, M. Bennet, A C Jones, Marc Phillipe Yves Desmulliez

Research output: Contribution to journal › Article › peer-review

22 Citations (Scopus)

Original language	English
Pages (from-to)	783-790
Number of pages	8
Journal	Microsystem Technologies
Volume	19
Issue number	6
DOIs	https://doi.org/10.1007/s00542-013-1746-7
Publication status	Published - Jun 2013

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10.1007/s00542-013-1746-7

Cite this

@article{0d39e89012604181bd3572e4f2e7e506,

title = "Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation",

author = "Suzanne Costello and N. Strusevich and David Flynn and Kay, {Robert W} and Patel, {M. K.} and Chris Bailey and D. Price and M. Bennet and Jones, {A C} and Desmulliez, {Marc Phillipe Yves}",

year = "2013",

month = jun,

doi = "10.1007/s00542-013-1746-7",

language = "English",

volume = "19",

pages = "783--790",

journal = "Microsystem Technologies",

issn = "0946-7076",

publisher = "Springer",

number = "6",

}

TY - JOUR

T1 - Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

AU - Costello, Suzanne

AU - Strusevich, N.

AU - Flynn, David

AU - Kay, Robert W

AU - Patel, M. K.

AU - Bailey, Chris

AU - Price, D.

AU - Bennet, M.

AU - Jones, A C

AU - Desmulliez, Marc Phillipe Yves

PY - 2013/6

Y1 - 2013/6

U2 - 10.1007/s00542-013-1746-7

DO - 10.1007/s00542-013-1746-7

M3 - Article

SN - 0946-7076

VL - 19

SP - 783

EP - 790

JO - Microsystem Technologies

JF - Microsystem Technologies

IS - 6

ER -