Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Suzanne Costello, N. Strusevich, David Flynn, Robert W Kay, M. K. Patel, Chris Bailey, D. Price, M. Bennet, A C Jones, Marc Phillipe Yves Desmulliez

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)783-790
Number of pages8
JournalMicrosystem Technologies
Volume19
Issue number6
DOIs
Publication statusPublished - Jun 2013

Cite this

Costello, S., Strusevich, N., Flynn, D., Kay, R. W., Patel, M. K., Bailey, C., Price, D., Bennet, M., Jones, A. C., & Desmulliez, M. P. Y. (2013). Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation. Microsystem Technologies, 19(6), 783-790. https://doi.org/10.1007/s00542-013-1746-7