Electrodeposition of copper into high aspect ratio PCB micro-via using megasonic agitation

Suzanne Costello, N. Strusevich, David Flynn, Robert W Kay, M. K. Patel, Chris Bailey, D. Price, M. Bennet, A C Jones, Marc Phillipe Yves Desmulliez

Research output: Contribution to journalArticle

13 Citations (Scopus)
Original languageEnglish
Pages (from-to)783-790
Number of pages8
JournalMicrosystem Technologies
Volume19
Issue number6
DOIs
Publication statusPublished - Jun 2013

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