Electrodeposited magnetostrictive Fe-Ga alloys for miniaturised actuators

Giuseppe Schiavone, Jack H. Ng, Paul M. Record, Xinxin Shang, Krystian L. Wlodarczyk, Duncan P. Hand, Gerard Cummins, Marc P Y Desmulliez

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

The application of magnetostrictive materials in MEMS devices requires the development of suitable micromachining technologies for the deposition and patterning at the microscale. Some alloys of iron and gallium, generally classified under the generic name of Galfenol (Fe1-x-Gax, 0.10 ≤x≤ 0.35), are known for their excellent magnetostrictive and mechanical properties, which make them ideal candidates for the manufacturing of magnetostrictive microactuator devices. Although techniques have been reported for the machining of such materials at a bigger scale, adequate miniaturisation technologies are sought after to enable the integration of Galfenol into MEMS devices. For this purpose, electrodeposition is an appealing technique as it enables rapid and relatively inexpensive growth, while eliminating the need for selective etching processes. This paper presents advances towards the development of a reliable and reproducible process for the electrodeposition of micrometre-thick Galfenol films through systematic experimental characterisation. A preliminary application is finally presented in the form of bilayer cantilevers fabricated by depositing Galfenol on top of copper beams that can be deflected by applying a uniform external magnetic field.

Original languageEnglish
Title of host publication2014 9th International Microsystems, Packaging, Assembly and Circuits Technology Conference
Subtitle of host publicationChallenges of Change - Shaping the Future, IMPACT 2014 - Proceedings
PublisherIEEE
Pages246-249
Number of pages4
ISBN (Print)9781479977277
DOIs
Publication statusPublished - 2015
Event9th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2014 - Taipei, Taiwan, Province of China
Duration: 22 Oct 201424 Oct 2014

Conference

Conference9th International Microsystems, Packaging, Assembly and Circuits Technology Conference 2014
Abbreviated titleIMPACT 2014
CountryTaiwan, Province of China
CityTaipei
Period22/10/1424/10/14

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering
  • Control and Systems Engineering

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