Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

M H Ayliffe, D Kabal, F Lacroix, E Bernier, P Khurana, A G Kirk, Frank Alan Paul Tooley, D V Plant

Research output: Contribution to journalArticle

12 Citations (Scopus)
Original languageEnglish
Pages (from-to)267-271
Number of pages5
JournalJournal of Optics A: Pure and Applied Optics
Volume1
Issue number2
DOIs
Publication statusPublished - Mar 1999

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