Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

M H Ayliffe, D Kabal, F Lacroix, E Bernier, P Khurana, A G Kirk, Frank Alan Paul Tooley, D V Plant

Research output: Contribution to journal › Article › peer-review

13 Citations (Scopus)

Original language	English
Pages (from-to)	267-271
Number of pages	5
Journal	Journal of Optics A: Pure and Applied Optics
Volume	1
Issue number	2
DOIs	https://doi.org/10.1088/1464-4258/1/2/029
Publication status	Published - Mar 1999

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title = "Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects",

author = "Ayliffe, {M H} and D Kabal and F Lacroix and E Bernier and P Khurana and Kirk, {A G} and Tooley, {Frank Alan Paul} and Plant, {D V}",

year = "1999",

month = mar,

doi = "10.1088/1464-4258/1/2/029",

language = "English",

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pages = "267--271",

journal = "Journal of Optics A: Pure and Applied Optics",

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T1 - Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

AU - Ayliffe, M H

AU - Kabal, D

AU - Lacroix, F

AU - Bernier, E

AU - Khurana, P

AU - Kirk, A G

AU - Tooley, Frank Alan Paul

AU - Plant, D V

PY - 1999/3

Y1 - 1999/3

U2 - 10.1088/1464-4258/1/2/029

DO - 10.1088/1464-4258/1/2/029

M3 - Article

SN - 1464-4258

VL - 1

SP - 267

EP - 271

JO - Journal of Optics A: Pure and Applied Optics

JF - Journal of Optics A: Pure and Applied Optics

IS - 2

ER -