Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

M H Ayliffe, D Kabal, F Lacroix, E Bernier, P Khurana, A G Kirk, Frank Alan Paul Tooley, D V Plant

Research output: Contribution to journalArticle

Original languageEnglish
Pages (from-to)267-271
Number of pages5
JournalJournal of Optics A: Pure and Applied Optics
Volume1
Issue number2
DOIs
Publication statusPublished - Mar 1999

Cite this

Ayliffe, M H ; Kabal, D ; Lacroix, F ; Bernier, E ; Khurana, P ; Kirk, A G ; Tooley, Frank Alan Paul ; Plant, D V. / Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects. In: Journal of Optics A: Pure and Applied Optics. 1999 ; Vol. 1, No. 2. pp. 267-271.
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Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects. / Ayliffe, M H; Kabal, D; Lacroix, F; Bernier, E; Khurana, P; Kirk, A G; Tooley, Frank Alan Paul; Plant, D V.

In: Journal of Optics A: Pure and Applied Optics, Vol. 1, No. 2, 03.1999, p. 267-271.

Research output: Contribution to journalArticle

TY - JOUR

T1 - Electrical, thermal and optomechanical packaging of large 2D optoelectronic device arrays for free-space optical interconnects

AU - Ayliffe, M H

AU - Kabal, D

AU - Lacroix, F

AU - Bernier, E

AU - Khurana, P

AU - Kirk, A G

AU - Tooley, Frank Alan Paul

AU - Plant, D V

PY - 1999/3

Y1 - 1999/3

U2 - 10.1088/1464-4258/1/2/029

DO - 10.1088/1464-4258/1/2/029

M3 - Article

VL - 1

SP - 267

EP - 271

JO - Journal of Optics A: Pure and Applied Optics

JF - Journal of Optics A: Pure and Applied Optics

SN - 1464-4258

IS - 2

ER -