Electrical test structure for the measurement of hermeticity in electronic and MEMS packages with small cavity volumes

Suzanne Costello, Marc Phillipe Yves Desmulliez, S McCracken, Eitan Abraham, Craig Lowrie, Scott Cargill

Research output: Contribution to journalArticle

1 Citation (Scopus)

Abstract

In this paper we present the first world realisation of a novel electromechanical sensor for the detection of hermeticity in low-cavity-volume packages. We designed, fabricated, and characterised this test structure. Its core element is a 0-level silicon cap acting as a piezoresistive deflecting membrane. The hermeticity of the package can then be determined in real-time. Low leak rates can be measured with a sensitivity two orders of magnitude lower than the limit of traditional helium fine leak test. Abraham’s contribution: development of theoretical model to calculate the voltage created by piezoresistors deposited on a square membrane
Original languageEnglish
Pages (from-to)281-287
Number of pages7
JournalIEEE Transactions on Semiconductor Manufacturing
Volume26
Issue number3
Early online date26 Jun 2013
DOIs
Publication statusPublished - Aug 2013

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