Elasticity of Diametrically Compressed Microfabricated Woodpile Lattices

Faezeh Shalchy*, Atul Bhaskar*

*Corresponding author for this work

Research output: Contribution to journalArticlepeer-review

23 Downloads (Pure)

Abstract

Modulus–porosity relationships are invaluable to rational material design of porous and structured solids. When struts in a lattice are compressed diametrically, the mechanics is rather complex. Herein, the problem of modulus–porosity in the spirit of scaling arguments and analyses based on simple ansatz followed by variational minimization of the elastic potential energy is addressed. Using scaling arguments, a simple power law where the apparent modulus of elasticity scales quadratically with the volume fraction for diametrically compressed elastic lattices is obtained. The modulus–porosity relationship is found to be consistent with computations and laboratory experiments on additively manufactured woodpile lattices with various cross‐sectional shapes and lattice spacing. It is also shown that the persistence length of diametrically pinched elastic rods is small, so that the effect of compressive strain from neighboring sites can be ignored. The decay behavior is surprisingly accurately captured by the variational approach and is consistent with computations. Finally, the range of validity of the quadratic power law presented here, up to relative density ~80%, is identified. On the apparent modulus–porosity plane, the experimental data aligns well with the power law for modulus–porosity predicted from simple analyses and finite element calculations.
Original languageEnglish
Article number2301158
JournalAdvanced Engineering Materials
Early online date14 Mar 2024
DOIs
Publication statusE-pub ahead of print - 14 Mar 2024

Keywords

  • biomedical scaffolds
  • lattice materials
  • metamaterials woodpile structures
  • elastic persistences

Fingerprint

Dive into the research topics of 'Elasticity of Diametrically Compressed Microfabricated Woodpile Lattices'. Together they form a unique fingerprint.

Cite this