Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

G. A J Markillie; Howard J. Baker; Francisco J. Villarreal; Denis R. Hall

doi:10.1364/AO.41.005660

Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

G. A J Markillie, Howard J. Baker, Francisco J. Villarreal, Denis R. Hall

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

62 Citations (Scopus)

Abstract

A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO₂ laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

Original language	English
Pages (from-to)	5660-5667
Number of pages	8
Journal	Applied Optics
Volume	41
Issue number	27
DOIs	https://doi.org/10.1364/AO.41.005660
Publication status	Published - 20 Sept 2002

Access to Document

10.1364/AO.41.005660

Cite this

@article{0cf4ca2926bd4fbe820bed1e3addada7,

title = "Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components",

abstract = "A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. {\textcopyright} 2002 Optical Society of America.",

author = "Markillie, \{G. A J\} and Baker, \{Howard J.\} and Villarreal, \{Francisco J.\} and Hall, \{Denis R.\}",

year = "2002",

month = sep,

day = "20",

doi = "10.1364/AO.41.005660",

language = "English",

volume = "41",

pages = "5660--5667",

journal = "Applied Optics",

issn = "1559-128X",

publisher = "Optica Publishing Group",

number = "27",

}

TY - JOUR

T1 - Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

AU - Markillie, G. A J

AU - Baker, Howard J.

AU - Villarreal, Francisco J.

AU - Hall, Denis R.

PY - 2002/9/20

Y1 - 2002/9/20

N2 - A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

AB - A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

UR - https://www.scopus.com/pages/publications/0037144856

U2 - 10.1364/AO.41.005660

DO - 10.1364/AO.41.005660

M3 - Article

SN - 1559-128X

VL - 41

SP - 5660

EP - 5667

JO - Applied Optics

JF - Applied Optics

IS - 27

ER -

Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

Abstract

Access to Document

Other files and links

Fingerprint

Cite this