Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

G. A J Markillie, Howard J. Baker, Francisco J. Villarreal, Denis R. Hall

Research output: Contribution to journalArticle

47 Citations (Scopus)

Abstract

A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

Original languageEnglish
Pages (from-to)5660-5667
Number of pages8
JournalApplied Optics
Volume41
Issue number27
DOIs
Publication statusPublished - 20 Sep 2002

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