Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

G. A J Markillie; Howard J. Baker; Francisco J. Villarreal; Denis R. Hall

doi:10.1364/AO.41.005660

Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

G. A J Markillie, Howard J. Baker, Francisco J. Villarreal, Denis R. Hall

School of Engineering & Physical Sciences

Research output: Contribution to journal › Article › peer-review

57 Citations (Scopus)

Abstract

A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO₂ laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

Original language	English
Pages (from-to)	5660-5667
Number of pages	8
Journal	Applied Optics
Volume	41
Issue number	27
DOIs	https://doi.org/10.1364/AO.41.005660
Publication status	Published - 20 Sept 2002

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title = "Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components",

abstract = "A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. {\textcopyright} 2002 Optical Society of America.",

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AB - A new regime for silica glass machining for micro-optical fabrication applications, which uses pulsed CO2 laser radiation in the 2.5-100-µs pulse width region that has been generated by an acousto-optic modulator, is investigated. A filamentary melt ejection process that generates fibers and significant melt displacement limits machining quality below 30-µs pulse width. Ablation and melt ejection thresholds are quantified relative to pulse width, and the region from 30 to 50 µs is identified for low-threshold, smooth machining without melt displacement and ejection effects. © 2002 Optical Society of America.

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Effect of vaporization and melt ejection on laser machining of silica glass micro-optical components

Abstract

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