Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards

A. C. Walker, H. Suyal, A. McCarthy

Research output: Chapter in Book/Report/Conference proceedingConference contribution

5 Citations (Scopus)

Abstract

We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.

Original languageEnglish
Title of host publicationProceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages977-979
Number of pages3
DOIs
Publication statusPublished - 2008
Event2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom
Duration: 1 Sep 20084 Sep 2008

Conference

Conference2008 2nd Electronics Systemintegration Technology Conference
Abbreviated titleESTC
CountryUnited Kingdom
CityGreenwich
Period1/09/084/09/08

Fingerprint Dive into the research topics of 'Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards'. Together they form a unique fingerprint.

Cite this