Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards

A. C. Walker; H. Suyal; A. McCarthy

doi:10.1109/ESTC.2008.4684484

Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards

A. C. Walker, H. Suyal, A. McCarthy

School of Engineering & Physical Sciences

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

5 Citations (Scopus)

Abstract

We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.

Original language	English
Title of host publication	Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC
Pages	977-979
Number of pages	3
DOIs	https://doi.org/10.1109/ESTC.2008.4684484
Publication status	Published - 2008
Event	2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sep 2008 → 4 Sep 2008

Conference

Conference	2008 2nd Electronics Systemintegration Technology Conference
Abbreviated title	ESTC
Country	United Kingdom
City	Greenwich
Period	1/09/08 → 4/09/08

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10.1109/ESTC.2008.4684484

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Cite this

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title = "Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards",

abstract = "We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded {"}Integrated Optical and Electronic Interconnect PCB Manufacturing{"} (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. {\textcopyright}2008 IEEE.",

author = "Walker, {A. C.} and H. Suyal and A. McCarthy",

year = "2008",

doi = "10.1109/ESTC.2008.4684484",

language = "English",

isbn = "9781424428144",

pages = "977--979",

booktitle = "Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC",

note = "2008 2nd Electronics Systemintegration Technology Conference, ESTC ; Conference date: 01-09-2008 Through 04-09-2008",

}

Walker, AC, Suyal, H & McCarthy, A 2008, Direct laser-writing of polymer structures for optical interconnects on backplane printed circuit boards. in Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC. pp. 977-979, 2008 2nd Electronics Systemintegration Technology Conference, Greenwich, United Kingdom, 1/09/08. https://doi.org/10.1109/ESTC.2008.4684484

TY - GEN

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AU - Walker, A. C.

AU - Suyal, H.

AU - McCarthy, A.

PY - 2008

Y1 - 2008

N2 - We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.

AB - We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.

U2 - 10.1109/ESTC.2008.4684484

DO - 10.1109/ESTC.2008.4684484

M3 - Conference contribution

SN - 9781424428144

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BT - Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC

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