Abstract
We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.
Original language | English |
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Title of host publication | Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC |
Pages | 977-979 |
Number of pages | 3 |
DOIs | |
Publication status | Published - 2008 |
Event | 2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom Duration: 1 Sept 2008 → 4 Sept 2008 |
Conference
Conference | 2008 2nd Electronics Systemintegration Technology Conference |
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Abbreviated title | ESTC |
Country/Territory | United Kingdom |
City | Greenwich |
Period | 1/09/08 → 4/09/08 |