We have previously developed a direct UV-laser-writing technique and custom photo-polymer optimised to form multimode polymer waveguides and embedded 45° out-of-plane mirrors. In the IeMRC funded "Integrated Optical and Electronic Interconnect PCB Manufacturing" (OPCB) project the key aim is to explore how these techniques can be extended to suit real-world optical backplane applications - both in the context of scale and manufacturability. In particular, we are assessing the viability of the technique for writing polymer optical waveguides of approximately 50 x 50 µm in cross-section over large metre-scale areas and the compatibility of this optical interconnect approach with existing PCB manufacturing processes. ©2008 IEEE.
|Title of host publication||Proceedings - 2008 2nd Electronics Systemintegration Technology Conference, ESTC|
|Number of pages||3|
|Publication status||Published - 2008|
|Event||2008 2nd Electronics Systemintegration Technology Conference - Greenwich, United Kingdom|
Duration: 1 Sep 2008 → 4 Sep 2008
|Conference||2008 2nd Electronics Systemintegration Technology Conference|
|Period||1/09/08 → 4/09/08|